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LM3S800-IGZ50-C2

Texas Instruments

LM3S800-IGZ50-C2 by Texas Instruments

LM3S800-IGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 8192 bytes of RAM, and 65536 ROM words. It operates at a max clock frequency of 0.032 MHz and is suitable for industrial applications requiring a powerful yet compact chip carrier package with PWM channels and ADC capabilities.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,263 parts In-Stock

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Digiode

USA . 2,356 parts In-Stock

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AZTECH Wire

Italy . 318 parts In-Stock

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$11.311

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One Stop Electronics

USA . 756 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,832 parts In-Stock

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$39.229

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DigiPath Technology Company

USA . 2,102 parts In-Stock

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$43.196

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$39.741

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IDEA Electronic Components Group

UK . 1,904 parts In-Stock

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$44.078

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$41.874

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$39.670

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ChromeModa Solutions

Germany . 1,519 parts In-Stock

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$44.078

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$36.144

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Microchip USA

USA . 2,984 parts In-Stock

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Corphita

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Kepictronics

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Overview

Elevate your projects with the LM3S800-IGZ50-C2 microcontroller from Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-quality products that exceed expectations. This microcontroller is versatile and reliable, suitable for a wide range of applications. Experience the value and benefits of Texas Instruments' innovative technology firsthand with the LM3S800-IGZ50-C2, providing superior performance and efficiency for all your electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller size and denser packaging, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V provides flexibility in power supply options for the device.

Package Shape: SQUARE

Square package shape facilitates easier placement and routing on PCBs, improving overall design efficiency.

Bit Size: 32

32-bit architecture enables high-performance processing capabilities for complex applications.

Power Supplies (V): 3.3

Stable power supply at 3.3 V ensures reliable operation of the microcontroller.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers robust protection and easy handling during assembly and production.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3 V allows for operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C makes the microcontroller suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range down to -40°C ensures reliable performance in harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels provide analog input capabilities for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position allows for easy integration into multi-channel systems or expansion boards.

ROM Words: 65536

Large ROM size of 65536 words enables storage of program code and data for versatile application development.

Maximum Seated Height: 1 mm

Low maximum seated height of 1 mm minimizes the overall profile of the microcontroller on the PCB.

Width: 6.875 mm

Compact width of 6.875 mm enables efficient space utilization in tight PCB layouts.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz allows for fast operation and real-time processing.

Length: 6.875 mm

Balanced length of 6.875 mm complements the square package shape for optimized placement on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in rugged environments and extended operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for the peripheral IC type provides efficient execution of instructions for responsive system operation.

RAM Bytes: 8192

Generous RAM size of 8192 bytes supports dynamic memory allocation for data processing and storage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient applications.

Terminal Form: NO LEAD

No lead terminal form simplifies assembly process and improves thermal performance for the device.

Maximum Supply Current: 110 mA

Maximum supply current of 110 mA indicates efficient power usage and stable operation under varying load conditions.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage at 3.3 V ensures compatibility with standard power sources and consistent performance.

PWM Channels: YES

Integrated PWM channels enable precise control of pulse-width modulation for motor control and analog signal generation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and flexible code storage options for program development.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5 mm simplifies PCB layout and routing for tight interconnection requirements.

Speed: 50 rpm

Operating speed of 50 rpm provides responsive performance for real-time applications and time-critical processes.

No. of I/O Lines: 36

Abundant I/O lines of 36 offer versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S800-IGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S800-IGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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