Loading...

LM3S800-EQN50-C2

Texas Instruments

LM3S800-EQN50-C2 by Texas Instruments

Texas Instruments LM3S800-EQN50-C2 microcontroller features 32-bit architecture, 3.3V supply, and 65536 ROM words. Ideal for industrial applications with -40 to 105°C operating range, it offers 36 I/O lines and PWM channels for versatile control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,862

-

-

-

-

Vyrian

USA . 282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

282

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 372 parts In-Stock

1+ parts

$10.053

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$10.053

-

-

-

One Stop Electronics

USA . 513 parts In-Stock

1+ parts

$34.000

100+ parts

-

1k+ parts

-

10k+ parts

-

513

$34.000

-

-

-

Parana Technologies

USA . 1,351 parts In-Stock

1+ parts

$50.466

100+ parts

-

1k+ parts

-

10k+ parts

-

1,351

$50.466

-

-

-

DigiPath Technology Company

USA . 2,002 parts In-Stock

1+ parts

$55.569

100+ parts

$51.123

1k+ parts

-

10k+ parts

-

2,002

$55.569

$51.123

-

-

ChromeModa Solutions

Germany . 2,837 parts In-Stock

1+ parts

$56.703

100+ parts

$46.496

1k+ parts

-

10k+ parts

-

2,837

$56.703

$46.496

-

-

IDEA Electronic Components Group

UK . 1,216 parts In-Stock

1+ parts

$56.703

100+ parts

$53.868

1k+ parts

$51.033

10k+ parts

-

1,216

$56.703

$53.868

$51.033

-

Corphita

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,780

-

-

-

-

Microchip USA

USA . 1,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,906

-

-

-

-

Overview

Experience the unparalleled innovation of the Texas Instruments LM3S800-EQN50-C2 microcontroller, a cutting-edge solution designed to exceed your expectations. With a focus on quality and reliability, Texas Instruments delivers a product that stands out in the crowded market of microcontrollers. Ideal for a wide range of applications, this device offers unmatched value with its advanced features and capabilities. Trust Texas Instruments to provide you with a top-of-the-line microcontroller that will elevate your projects to new heights. Elevate your work with the LM3S800-EQN50-C2 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package durable and resistant to external impacts, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing processes.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage provides flexibility in power supply options, allowing for compatibility with a wider range of systems and applications.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex tasks and calculations efficiently, making it suitable for a variety of advanced applications.

Power Supplies (V): 3.3

Operating at a standard 3.3V power supply voltage, this microcontroller is compatible with many common power sources, simplifying design considerations.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with external components and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact form factor, saving space on the circuit board and allowing for more efficient use of limited board real estate.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this microcontroller can withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold environments, making it suitable for a wide range of applications.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and signals, expanding its capabilities.

Technical Specifications

Microcontrollers LM3S800-EQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S800-EQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20