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LM3S6C65-IQC80-A2

Texas Instruments

LM3S6C65-IQC80-A2 by Texas Instruments

LM3S6C65-IQC80-A2 by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU, 65536 bytes of RAM, and 524288 ROM words. It operates at a max clock frequency of 16.384 MHz and has 46 I/O lines for industrial applications requiring high-speed processing and efficient memory management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,624 parts In-Stock

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8,624

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Digiode

USA . 1,605 parts In-Stock

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1,605

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Distributors (Availability)

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Parana Technologies

USA . 1,747 parts In-Stock

1+ parts

$16.613

100+ parts

-

1k+ parts

$16.886

10k+ parts

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1,747

$16.613

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$16.886

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IDEA Electronic Components Group

UK . 410 parts In-Stock

1+ parts

$18.666

100+ parts

$17.733

1k+ parts

$16.799

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-

410

$18.666

$17.733

$16.799

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ChromeModa Solutions

Germany . 75 parts In-Stock

1+ parts

$18.666

100+ parts

$15.306

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75

$18.666

$15.306

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AZTECH Wire

Italy . 569 parts In-Stock

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$18.687

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569

$18.687

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One Stop Electronics

USA . 1,128 parts In-Stock

1+ parts

$19.000

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1,128

$19.000

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Corphita

USA . 3,385 parts In-Stock

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3,385

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DigiPath Technology Company

USA . 1,352 parts In-Stock

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$16.829

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$16.829

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Perfect Parts

USA . 445 parts In-Stock

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445

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Microchip USA

USA . 401 parts In-Stock

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401

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Overview

Revolutionize your projects with the LM3S6C65-IQC80-A2 microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers unrivaled performance and reliability for a wide range of applications. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this Cortex-M3 based microcontroller delivers seamless integration, high-speed processing, and low power consumption. Experience innovation at its finest with Texas Instruments and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material in the package body makes this microcontroller lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly processes, saving time and labor costs.

Maximum Supply Voltage: 1.365 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, leading to greater energy efficiency.

Package Shape: SQUARE

The square package shape makes it easier to design and layout on a PCB, optimizing space utilization for compact designs.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers higher performance and processing capabilities compared to lower bit sizes.

Power Supplies (V): 1.3,3.3

Supporting multiple power supply voltages provides flexibility in design and compatibility with various systems and components.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and peripherals to be integrated, enhancing functionality.

Minimum Supply Voltage: 1.235 V

The low minimum supply voltage ensures reliable operation even under low power conditions, making it suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range enables the microcontroller to withstand harsh environmental conditions without compromising performance.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family ensures compatibility with a wide range of software and development tools, facilitating faster and easier prototyping.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range makes this microcontroller suitable for use in extreme cold environments without impacting performance.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows for analog signal inputs to be processed, expanding the range of applications this microcontroller can be used for.

DMA Channels: YES

Having Direct Memory Access (DMA) channels improves data transfer efficiency and speed, reducing CPU overhead and optimizing system performance.

ROM Words: 524288

With a large Read-Only Memory (ROM) capacity, this microcontroller can store a significant amount of program data and instructions for complex applications.

Width: 14 mm

The compact width of this microcontroller allows for efficient use of PCB space, enabling smaller and more streamlined device designs.

Maximum Clock Frequency: 16.384 MHz

The high maximum clock frequency supports fast and responsive operation, critical for time-sensitive applications and real-time processing.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper and consistent soldering during assembly, enhancing the reliability of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering and assembly processes, ensuring the longevity and durability of the microcontroller.

Length: 14 mm

The optimal length of this microcontroller contributes to a balanced and space-efficient PCB layout, improving overall system integration and design.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges makes this microcontroller suitable for rugged and demanding environments, ensuring reliable performance in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller enhances processing speed and efficiency, enabling rapid execution of instructions for high-performance applications.

RAM Bytes: 65536

With a generous Random Access Memory (RAM) capacity, this microcontroller can efficiently store and access data during operation, enhancing multitasking capabilities.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high noise immunity, and reliable operation, making this microcontroller energy-efficient and robust.

Terminal Form: GULL WING

The gull wing terminal form factor enables secure and reliable connections during soldering and assembly, enhancing the overall durability and longevity of the product.

Maximum Supply Current: 210 mA

The specified maximum supply current ensures proper power distribution and regulation, preventing overloading and safeguarding the microcontroller from electrical damage.

Nominal Supply Voltage: 1.3 V

The stable nominal supply voltage ensures consistent and reliable operation, minimizing the risk of voltage fluctuations impacting performance.

PWM Channels: YES

The availability of Pulse-Width Modulation (PWM) channels allows for precise control of analog signals, enabling accurate and efficient motor control and power management.

ROM Programmability: FLASH

The Flash ROM programmability feature enables easy and quick updating of firmware and software, facilitating rapid prototyping and development cycles.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for dense and compact PCB designs, maximizing space efficiency and enabling intricate circuit layouts for advanced applications.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate moisture sensitivity, requiring standard handling and storage procedures to prevent moisture-related damage during assembly and operation.

Speed: 80 rpm

The specified speed rating ensures efficient and reliable performance for motor control applications, enabling precise speed regulation and operation.

No. of I/O Lines: 46

With a sufficient number of Input/Output (I/O) lines, this microcontroller can interface with a variety of external devices and sensors, expanding its connectivity options and versatility.

Technical Specifications

Microcontrollers LM3S6C65-IQC80-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6C65-IQC80-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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