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LM3S6952-IQC50-A2T

Texas Instruments

LM3S6952-IQC50-A2T by Texas Instruments

LM3S6952-IQC50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, making it ideal for industrial applications requiring high-speed processing and extensive memory capabilities. With a package style of FLATPACK and GULL WING terminal form, this microcontroller is suitable for surface mount designs in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,422 parts In-Stock

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5,422

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Digiode

USA . 2,180 parts In-Stock

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2,180

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Chip Stock

USA . 533 parts In-Stock

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533

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 606 parts In-Stock

1+ parts

$8.000

100+ parts

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606

$8.000

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AZTECH Wire

Italy . 232 parts In-Stock

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$18.549

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232

$18.549

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One Stop Electronics

USA . 1,522 parts In-Stock

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$30.000

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1,522

$30.000

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$42.444

100+ parts

$3,941.578

1k+ parts

$38.200

10k+ parts

-

1,380

$42.444

$3,941.578

$38.200

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DigiPath Technology Company

USA . 1,795 parts In-Stock

1+ parts

$46.736

100+ parts

$42.997

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1,795

$46.736

$42.997

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ChromeModa Solutions

Germany . 4,257 parts In-Stock

1+ parts

$47.690

100+ parts

$39.106

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4,257

$47.690

$39.106

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IDEA Electronic Components Group

UK . 559 parts In-Stock

1+ parts

$47.690

100+ parts

$45.306

1k+ parts

$42.921

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559

$47.690

$45.306

$42.921

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Modulus Dynamics

Lithuania . 100 parts In-Stock

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$59.067

100+ parts

$59.067

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$59.067

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100

$59.067

$59.067

$59.067

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QUARKTWIN TECHNOLOGY LTD

USA . 6,315 parts In-Stock

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Microchip USA

USA . 5,661 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 776 parts In-Stock

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776

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Overview

Unleash the power of innovation with the LM3S6952-IQC50-A2T microcontroller by Texas Instruments. Designed with precision and expertise, this cutting-edge device offers unmatched quality and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers exceptional performance and efficiency. Experience seamless integration and superior functionality with the LM3S6952-IQC50-A2T, setting new standards in the world of technology. Elevate your projects with Texas Instruments and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and cost-effectiveness in electronic components.

Surface Mount: YES

This feature makes the microcontroller easy to install on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 2.75 V

This low maximum supply voltage is ideal for applications where low power consumption is critical.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the PCB.

Bit Size: 32

A 32-bit microcontroller offers higher processing power and performance compared to lower bit sizes.

Power Supplies (V): 2.5,3.3

The availability of different power supply options allows flexibility in designing circuits with varying voltage requirements.

No. of Terminals: 100

Having a high number of terminals provides more connection options for interfacing with external devices.

Package Style (Meter): FLATPACK

The flatpack style is known for its slim profile, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, the microcontroller can operate efficiently even at lower power levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the microcontroller to function reliably in both hot and cold environments.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

The inclusion of analog-to-digital converter (ADC) channels allows for the conversion of analog signals to digital data, expanding the microcontroller's capabilities.

Terminal Position: QUAD

The quad terminal position enables easier soldering and inspection on the PCB.

ROM Words: 262144

The large ROM size provides ample storage for program instructions and data, making the microcontroller suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low profile of the microcontroller makes it suitable for slim and compact device designs.

Width: 14 mm

The moderate width of the microcontroller allows for a balance between space-saving and ease of handling during assembly.

Maximum Clock Frequency: 8.192 MHz

The high clock frequency enables fast processing of instructions, enhancing the overall performance of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature reduces the risk of component damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper solder reflow for reliable connections on the circuit board.

Length: 14 mm

The moderate length of the microcontroller contributes to a balanced size that fits well in various electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with Reduced Instruction Set Computing (RISC) architecture offers efficient instruction execution and high performance.

RAM Bytes: 65536

The large RAM size provides ample temporary storage for data processing, enhancing the microcontroller's capabilities.

Technology: CMOS

CMOS technology offers low power consumption, making the microcontroller energy-efficient and suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy placement and soldering of the microcontroller on the PCB.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage indicates the standard operating voltage for optimal performance.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels enable precise control of output signals, making the microcontroller versatile for various applications.

ROM Programmability: FLASH

The flash ROM programmability allows for easy updating of firmware and software, enhancing the flexibility of the microcontroller.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting of the microcontroller on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling.

Speed: 50 rpm

The speed specification may refer to the clock frequency or processing speed of the microcontroller, indicating its performance capabilities.

No. of I/O Lines: 43

The high number of input/output lines offers versatile connectivity options for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S6952-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6952-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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