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LM3S6952-IQC50-A2

Texas Instruments

LM3S6952-IQC50-A2 by Texas Instruments

Texas Instruments LM3S6952-IQC50-A2 is a 32-bit Cortex-M3 microcontroller with 262144 ROM words and 65536 RAM bytes. It features 4 PWM channels, Ethernet connectivity, and operates at a max clock frequency of 8.192 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$23.740

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$23.740

1k+ parts

$21.240

10k+ parts

$19.990

2

-

$23.740

$21.240

$19.990

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,547 parts In-Stock

1+ parts

$25.052

100+ parts

-

1k+ parts

-

10k+ parts

-

3,547

$25.052

-

-

-

Vyrian

USA . 6,844 parts In-Stock

1+ parts

-

100+ parts

-

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-

6,844

-

-

-

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Chip Stock

USA . 1,033 parts In-Stock

1+ parts

-

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-

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-

10k+ parts

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1,033

-

-

-

-

Connector Distribution Corp

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8

-

-

-

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Right Parts Inc.

USA . 8 parts In-Stock

1+ parts

-

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-

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-

8

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 526 parts In-Stock

1+ parts

$9.420

100+ parts

-

1k+ parts

-

10k+ parts

-

526

$9.420

-

-

-

Parana Technologies

USA . 702 parts In-Stock

1+ parts

$21.857

100+ parts

$2,029.719

1k+ parts

$19.671

10k+ parts

-

702

$21.857

$2,029.719

$19.671

-

Corphita

USA . 1,155 parts In-Stock

1+ parts

$23.733

100+ parts

-

1k+ parts

-

10k+ parts

-

1,155

$23.733

-

-

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DigiPath Technology Company

USA . 1,619 parts In-Stock

1+ parts

$24.067

100+ parts

-

1k+ parts

-

10k+ parts

-

1,619

$24.067

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ChromeModa Solutions

Germany . 4,690 parts In-Stock

1+ parts

$24.558

100+ parts

$20.138

1k+ parts

-

10k+ parts

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4,690

$24.558

$20.138

-

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IDEA Electronic Components Group

UK . 572 parts In-Stock

1+ parts

$24.558

100+ parts

$23.330

1k+ parts

$22.102

10k+ parts

-

572

$24.558

$23.330

$22.102

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QUARKTWIN TECHNOLOGY LTD

USA . 20,901 parts In-Stock

1+ parts

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20,901

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Microchip USA

USA . 447 parts In-Stock

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447

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Overview

Experience the next level of performance with the LM3S6952-IQC50-A2 by Texas Instruments, a top-tier microcontroller designed to exceed your expectations. With advanced features like integrated cache, multiple power supplies, and a wide range of peripherals including PWM, QEI, and timers, this versatile device is perfect for a variety of industrial applications. Trust in Texas Instruments' reputation for quality and reliability, and unlock the full potential of your projects with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the internal components of the microcontroller, ensuring long-term reliability.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and overall performance of the microcontroller by reducing access time to frequently used data.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and prevents damage to the microcontroller from overvoltage conditions.

On Chip Data RAM Width: 8

With a data RAM width of 8, the microcontroller can efficiently handle and process data, leading to faster and more accurate calculations.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computer (RISC) architecture, this product is designed for efficient and streamlined operation, making it suitable for various applications.

Width: 14 mm

The compact width of 14 mm makes this microcontroller suitable for applications where space is limited, allowing for easy integration into small devices or systems.

Technical Specifications

Microcontrollers LM3S6952-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

43

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C, SSI(2), UART(3)

Peripherals:

PWM(4), QEI, TIMER(3), WDT

Trade Compliance

LM3S6952-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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