Loading...

LM3S6952-EQC50-A2

Texas Instruments

LM3S6952-EQC50-A2 by Texas Instruments

LM3S6952-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 8.192 MHz, it offers 43 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,094 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,094

-

-

-

-

Digiode

USA . 1,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,034

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 284 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

284

$6.000

-

-

-

AZTECH Wire

Italy . 632 parts In-Stock

1+ parts

$9.904

100+ parts

-

1k+ parts

-

10k+ parts

-

632

$9.904

-

-

-

Parana Technologies

USA . 730 parts In-Stock

1+ parts

$69.271

100+ parts

-

1k+ parts

-

10k+ parts

-

730

$69.271

-

-

-

DigiPath Technology Company

USA . 423 parts In-Stock

1+ parts

$76.276

100+ parts

-

1k+ parts

-

10k+ parts

-

423

$76.276

-

-

-

ChromeModa Solutions

Germany . 5,866 parts In-Stock

1+ parts

$77.833

100+ parts

$63.823

1k+ parts

-

10k+ parts

-

5,866

$77.833

$63.823

-

-

IDEA Electronic Components Group

UK . 1,358 parts In-Stock

1+ parts

$77.833

100+ parts

$73.941

1k+ parts

$70.050

10k+ parts

-

1,358

$77.833

$73.941

$70.050

-

Corphita

USA . 4,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,400

-

-

-

-

Microchip USA

USA . 3,866 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,866

-

-

-

-

Overview

Unleash the power of innovation with the LM3S6952-EQC50-A2 microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. Perfect for a wide range of applications, this microcontroller offers unparalleled value, benefits, and advantages to customers. Experience seamless performance, reliability, and efficiency with the LM3S6952-EQC50-A2 - your ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in providing durability and reliability to the product, making it a suitable choice for long-term use.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, reducing manufacturing time and costs.

Maximum Supply Voltage: 2.75 V

Operates within a safe voltage range, ensuring stable performance without the risk of damage due to overvoltage.

Bit Size: 32

32-bit architecture allows for higher processing power and capability, making it suitable for complex applications and tasks.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, providing flexibility in system design and compatibility with various components.

No. of Terminals: 100

Ample number of terminals allow for versatile connectivity options and integration with a wide range of external devices and peripherals.

Package Style (Meter): FLATPACK

Flatpack design offers a compact form factor, saving space on the PCB and enabling more efficient use of available board real estate.

Minimum Operating Temperature: -40 °C

Remarkable temperature tolerance ensures reliable operation even in extreme cold conditions, making it suitable for a variety of environments.

ROM Words: 262144

Large ROM capacity allows for storing and running complex programs and algorithms, enhancing the functionality and performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing efficiency and speed, making the microcontroller ideal for applications requiring high performance and responsiveness.

RAM Bytes: 65536

Generous RAM capacity enables efficient data processing and multitasking, facilitating the execution of complex operations and algorithms.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation of the microcontroller.

Technical Specifications

Microcontrollers LM3S6952-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

43

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6952-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20