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LM3S6950-IQC50-A2

Texas Instruments

LM3S6950-IQC50-A2 by Texas Instruments

Texas Instruments LM3S6950-IQC50-A2 microcontroller features 32-bit Cortex-M3 CPU, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications with Ethernet connectivity, it offers 4 timers, PWM channels, and ADC channels for precise control in a compact package.

Median Price

$59.580

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 90 parts In-Stock

1+ parts

$59.580

100+ parts

$43.888

1k+ parts

-

10k+ parts

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90

$59.580

$43.888

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,389 parts In-Stock

1+ parts

$31.882

100+ parts

-

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10k+ parts

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4,389

$31.882

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Vyrian

USA . 6,124 parts In-Stock

1+ parts

-

100+ parts

-

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6,124

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-

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Chip Stock

USA . 197 parts In-Stock

1+ parts

-

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197

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 235 parts In-Stock

1+ parts

$25.336

100+ parts

-

1k+ parts

$25.959

10k+ parts

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235

$25.336

-

$25.959

-

DigiPath Technology Company

USA . 270 parts In-Stock

1+ parts

$27.898

100+ parts

$25.666

1k+ parts

-

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270

$27.898

$25.666

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-

ChromeModa Solutions

Germany . 6,440 parts In-Stock

1+ parts

$28.467

100+ parts

$23.343

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6,440

$28.467

$23.343

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IDEA Electronic Components Group

UK . 2,165 parts In-Stock

1+ parts

$28.467

100+ parts

$27.044

1k+ parts

$25.620

10k+ parts

-

2,165

$28.467

$27.044

$25.620

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Corphita

USA . 1,906 parts In-Stock

1+ parts

$30.204

100+ parts

-

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1,906

$30.204

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$35.645

100+ parts

$32.437

1k+ parts

$29.229

10k+ parts

-

500

$35.645

$32.437

$29.229

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Microchip USA

USA . 1,801 parts In-Stock

1+ parts

$101.590

100+ parts

$99.820

1k+ parts

$98.940

10k+ parts

$98.060

1,801

$101.590

$99.820

$98.940

$98.060

Lixinc

USA . 19,868 parts In-Stock

1+ parts

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19,868

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

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2,700

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Kepictronics

USA . 49 parts In-Stock

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49

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Overview

Unlock the power of cutting-edge technology with the LM3S6950-IQC50-A2 by Texas Instruments. Manufactured with precision and expertise, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides integrated cache, low power mode, and a variety of peripherals including PWM, QEI, and timers. With a maximum clock frequency of 8.192 MHz and ROM programmability, this product delivers exceptional performance and versatility. Experience the value and benefits of Texas Instruments' expertise in microcontroller technology with the LM3S6950-IQC50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Having an integrated cache helps improve the overall performance of the microcontroller by reducing access time to frequently used data and instructions.

Maximum Supply Voltage: 2.75 V

The moderate maximum supply voltage of 2.75 V helps in ensuring the safety of the microcontroller and connected components, preventing damage from voltage spikes.

On Chip Data RAM Width: 8

Having an 8-bit data RAM width allows for efficient handling of data within the microcontroller, enhancing processing speed and performance.

Package Shape: SQUARE

The square package shape makes it easy to mount and integrate the microcontroller into various electronic systems, optimizing space utilization.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex calculations and operations, making it suitable for a wide range of applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in designing and powering the system, ensuring compatibility with different components.

No. of Terminals: 100

Having 100 terminals provides a sufficient number of connection points for interfacing with external devices and peripherals, enhancing the microcontroller's functionality.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and low-profile design, making it suitable for space-constrained applications while also providing ease of installation.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures reliable operation of the microcontroller even under low voltage conditions, enhancing system stability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C makes the microcontroller suitable for industrial environments where temperature fluctuations are common.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers a balance of performance and power efficiency, making the microcontroller suitable for various embedded applications requiring real-time processing.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures the microcontroller can operate in extreme cold conditions, providing versatility in deployment environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish helps in preventing corrosion and ensuring reliable electrical connections, enhancing the overall longevity of the microcontroller.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, enabling the system to measure and process real-world data accurately.

Terminal Position: QUAD

The quad terminal position offers a stable and secure mounting arrangement, ensuring reliable connections and reducing the risk of signal interference or disconnection.

ROM Words: 262144

With a large ROM capacity of 262144 words, the microcontroller can store a significant amount of program code and data, accommodating complex software requirements.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for a compact overall system design, making the microcontroller suitable for applications with space constraints.

Width: 14 mm

The 14 mm width of the microcontroller offers a balance between compactness and accessibility for connections, simplifying the integration process within electronic systems.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging of the microcontroller during the manufacturing process, ensuring quality control and reliability.

Peripherals: PWM(6), QEI, TIMER(4), WDT

The inclusion of various peripherals such as PWM, QEI, timers, and watchdog timer enhances the microcontroller's versatility and functionality for diverse application requirements.

Technical Specifications

Microcontrollers LM3S6950-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

41

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C, SSI(2), UART(3)

Peripherals:

PWM(6), QEI, TIMER(4), WDT

Trade Compliance

LM3S6950-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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