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LM3S6753-EQC50-A2T

Texas Instruments

LM3S6753-EQC50-A2T by Texas Instruments

Texas Instruments' LM3S6753-EQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it offers 41 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,108 parts In-Stock

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7,108

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Digiode

USA . 3,531 parts In-Stock

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3,531

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Distributors (Availability)

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AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$6.877

100+ parts

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861

$6.877

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One Stop Electronics

USA . 299 parts In-Stock

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$11.000

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299

$11.000

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Parana Technologies

USA . 1,702 parts In-Stock

1+ parts

$68.132

100+ parts

$6,327.105

1k+ parts

$61.319

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1,702

$68.132

$6,327.105

$61.319

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DigiPath Technology Company

USA . 2,344 parts In-Stock

1+ parts

$75.022

100+ parts

$69.020

1k+ parts

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2,344

$75.022

$69.020

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IDEA Electronic Components Group

UK . 2,070 parts In-Stock

1+ parts

$76.553

100+ parts

$72.725

1k+ parts

$68.898

10k+ parts

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2,070

$76.553

$72.725

$68.898

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ChromeModa Solutions

Germany . 1,868 parts In-Stock

1+ parts

$76.553

100+ parts

$62.773

1k+ parts

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1,868

$76.553

$62.773

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Corphita

USA . 435 parts In-Stock

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435

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Microchip USA

USA . 329 parts In-Stock

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329

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Overview

Unlock the power of innovation with the LM3S6753-EQC50-A2T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. This product is perfect for a wide range of applications, offering customers unmatched value and benefits. With its advanced features and superior performance, the LM3S6753-EQC50-A2T is the ideal choice for your next project. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package ensures the product is sturdy and easy to handle.

Surface Mount: YES

Facilitates easy installation and maintenance of the microcontroller on circuit boards.

Maximum Supply Voltage: 2.75 V

Optimal supply voltage range for efficient performance and power consumption.

Package Shape: SQUARE

Compact square shape allows for efficient use of space on the circuit board.

Bit Size: 32

Higher bit size allows for processing more data at once, enhancing the microcontroller's performance.

Power Supplies (V): 2.5,3.3

Support for multiple power supplies provides flexibility in design and compatibility with different systems.

No. of Terminals: 100

Sufficient terminals for connectivity and interfacing with other components in the system.

Package Style (Meter): FLATPACK

Flatpack design enables easy integration into various electronic devices and systems.

Minimum Supply Voltage: 2.25 V

Wide range of supply voltage ensures stable operation under varying conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature makes the microcontroller suitable for industrial applications with demanding environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the microcontroller to function in extreme cold conditions.

Terminal Finish: TIN

TIN finish on terminals provides corrosion resistance and ensures reliable connections.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connection of external components.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.6 mm

Low seated height minimizes the space required for mounting the microcontroller.

Width: 14 mm

Compact width makes the microcontroller suitable for space-constrained designs.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast processing of instructions and data.

Length: 14 mm

Compact length allows for efficient placement on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing power for various embedded applications.

RAM Bytes: 65536

Large RAM capacity allows for storage and manipulation of data during runtime.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for improved performance.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and ensures reliable electrical connections.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance under normal operating conditions.

PWM Channels: YES

Support for PWM channels enables precise control of output signals for motor control and other applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating of firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact layout and high-density integration on the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller's resistance to moisture and humidity, suitable for various environments.

Speed: 50 rpm

Operating at 50 rpm provides quick response times and efficient processing of data.

No. of I/O Lines: 41

Sufficient I/O lines for interfacing with external devices and peripherals, enhancing the microcontroller's capabilities.

Technical Specifications

Microcontrollers LM3S6753-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6753-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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