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LM3S6730-EQC50-A2

Texas Instruments

LM3S6730-EQC50-A2 by Texas Instruments

Texas Instruments LM3S6730-EQC50-A2 is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it features 46 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,964 parts In-Stock

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7,964

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Digiode

USA . 2,778 parts In-Stock

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2,778

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Distributors (Availability)

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One Stop Electronics

USA . 1,271 parts In-Stock

1+ parts

$11.000

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$11.000

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AZTECH Wire

Italy . 190 parts In-Stock

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$14.942

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190

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Parana Technologies

USA . 2,000 parts In-Stock

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$53.898

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$53.898

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DigiPath Technology Company

USA . 815 parts In-Stock

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$59.348

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815

$59.348

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IDEA Electronic Components Group

UK . 1,873 parts In-Stock

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$60.559

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$57.531

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$54.503

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1,873

$60.559

$57.531

$54.503

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ChromeModa Solutions

Germany . 33 parts In-Stock

1+ parts

$60.559

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$49.658

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33

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$49.658

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Corphita

USA . 4,755 parts In-Stock

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Microchip USA

USA . 111 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S6730-EQC50-A2 by Texas Instruments, a cutting-edge microcontroller that sets new standards in performance and reliability. Designed with precision and expertise by one of the most trusted manufacturers in the industry, this versatile device is perfect for a wide range of applications. From robotics to automation, this powerhouse delivers unmatched value, benefits, and advantages to customers seeking top-notch quality and innovation. Experience the future of technology with the LM3S6730-EQC50-A2 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic components.

Surface Mount: YES

Easy to solder onto circuit boards, saving time during assembly.

Maximum Supply Voltage: 2.75 V

Efficient power usage and protection for connected devices.

Package Shape: SQUARE

Space-saving design, fits neatly into compact electronic devices.

Bit Size: 32

High-performance processing capabilities for complex tasks.

Power Supplies (V): 2.5, 3.3

Versatile voltage options for different power requirements.

No. of Terminals: 100

Sufficient connectivity options for various external devices.

Package Style (Meter): FLATPACK

Streamlined package design for easy integration into circuit layouts.

Minimum Supply Voltage: 2.25 V

Stable operation even at lower voltage levels, improving efficiency.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operational in extremely cold conditions, expanding usability.

ADC Channels: YES

Ability to convert analog signals to digital data for processing.

Terminal Position: QUAD

Clear layout for terminals, aiding in connections and troubleshooting.

ROM Words: 131072

Large storage capacity for program data and instructions.

Maximum Seated Height: 1.6 mm

Low profile design, suitable for compact electronic devices.

Width: 14 mm

Compact size for easy integration in various applications.

Maximum Clock Frequency: 0.032 MHz

High-speed processing capabilities for quick data handling.

Length: 14 mm

Square shape for efficient use of space in electronic designs.

Temperature Grade: INDUSTRIAL

Designed for reliable operation in harsh industrial conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Specifically designed for microcontroller applications, enhancing performance.

RAM Bytes: 65536

Large memory capacity for data storage and processing.

Technology: CMOS

Power-efficient technology for extended battery life.

Terminal Form: GULL WING

Secure terminal layout for stable connections.

Nominal Supply Voltage: 2.5 V

Stable voltage supply for consistent performance.

PWM Channels: YES

Ability to generate pulse-width modulation signals for motor control.

ROM Programmability: FLASH

Flash memory for easy reprogramming and updating of software.

Terminal Pitch: 0.5 mm

Fine pitch terminals for precise connections and compact layout.

Speed: 50 rpm

Operates at a moderate speed, suitable for various applications.

No. of I/O Lines: 46

Sufficient input/output lines for connecting external devices and components.

Technical Specifications

Microcontrollers LM3S6730-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6730-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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