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LM3S6637-EQC50-A2

Texas Instruments

LM3S6637-EQC50-A2 by Texas Instruments

Texas Instruments' LM3S6637-EQC50-A2 is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it offers 41 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,760 parts In-Stock

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Digiode

USA . 386 parts In-Stock

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One Stop Electronics

USA . 1,212 parts In-Stock

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$3.000

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Parana Technologies

USA . 1,621 parts In-Stock

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$16.129

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$16.457

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ChromeModa Solutions

Germany . 5,062 parts In-Stock

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$18.123

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$14.861

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IDEA Electronic Components Group

UK . 112 parts In-Stock

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$17.217

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$16.311

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112

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AZTECH Wire

Italy . 357 parts In-Stock

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$18.214

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QUARKTWIN TECHNOLOGY LTD

USA . 9,708 parts In-Stock

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Microchip USA

USA . 5,326 parts In-Stock

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Corphita

USA . 4,132 parts In-Stock

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DigiPath Technology Company

USA . 1,810 parts In-Stock

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$16.340

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Overview

Unleash the power of innovation with the LM3S6637-EQC50-A2 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers unrivaled quality and reliability in every product. The LM3S6637-EQC50-A2 is packed with features that make it ideal for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers unmatched performance and flexibility. Transform your designs with the LM3S6637-EQC50-A2 and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for smaller component size, saving space and making assembly easier.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and protection of the microcontroller.

Bit Size: 32

The 32-bit architecture provides high performance and processing capabilities for complex applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility.

No. of Terminals: 100

The high number of terminals allows for versatile connectivity and integration with other components.

Package Style (Meter): FLATPACK

The flatpack package style offers easy installation and maintenance for the microcontroller.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures efficient power usage and stability of the device.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C enables usage in industrial environments with varying conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable operation in extreme cold environments.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables accurate and precise analog signal processing.

Terminal Position: QUAD

The quad terminal positioning facilitates easier and organized connections with other components.

ROM Words: 131072

The large ROM capacity of 131072 words allows for ample storage of program instructions and data.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6 mm enables compact design and integration of the microcontroller in tight spaces.

Width: 14 mm

The width of 14 mm offers a balance between size and functionality for the microcontroller.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 0.032 MHz provides fast processing speed for time-sensitive applications.

Length: 14 mm

The length of 14 mm complements the width and seated height, creating a compact form factor for the microcontroller.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers efficient instruction execution and faster operation for optimized performance.

RAM Bytes: 32768

The substantial RAM capacity of 32768 bytes allows for efficient data processing and storage during operation.

Technology: CMOS

The CMOS technology provides low power consumption, high speed, and compatibility with various digital systems.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable connections during installation and operation.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V sets a standard operating voltage for the microcontroller to ensure consistent performance.

PWM Channels: YES

The presence of Pulse-Width Modulation channels allows for precise control of output signals and improved system efficiency.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility in updating firmware and software applications without the need for external programming devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting and compact layout design for the microcontroller.

Speed: 50 rpm

The speed of 50 rpm indicates the rotational speed, which may be relevant for specific applications or motor control.

No. of I/O Lines: 41

The 41 I/O lines provide ample input and output options for connecting with external devices and peripherals, enhancing system flexibility.

Technical Specifications

Microcontrollers LM3S6637-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

41

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6637-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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