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LM3S6633-IBZ50-A2T

Texas Instruments

LM3S6633-IBZ50-A2T by Texas Instruments

LM3S6633-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring up to 41 I/O lines and PWM channels. With a temperature range from -40 to 85 °C, it offers versatile performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,493 parts In-Stock

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6,493

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Digiode

USA . 1,915 parts In-Stock

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1,915

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Distributors (Availability)

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One Stop Electronics

USA . 1,114 parts In-Stock

1+ parts

$15.000

100+ parts

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1,114

$15.000

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AZTECH Wire

Italy . 580 parts In-Stock

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$17.196

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580

$17.196

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Parana Technologies

USA . 1,298 parts In-Stock

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$27.169

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$32.886

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1,298

$27.169

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$32.886

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DigiPath Technology Company

USA . 1,511 parts In-Stock

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$29.916

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1,511

$29.916

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ChromeModa Solutions

Germany . 2,748 parts In-Stock

1+ parts

$30.527

100+ parts

$25.032

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2,748

$30.527

$25.032

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IDEA Electronic Components Group

UK . 341 parts In-Stock

1+ parts

$30.527

100+ parts

$29.001

1k+ parts

$27.474

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341

$30.527

$29.001

$27.474

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Component Stockers USA

USA . 670 parts In-Stock

1+ parts

$99.990

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670

$99.990

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Corphita

USA . 4,691 parts In-Stock

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4,691

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Microchip USA

USA . 217 parts In-Stock

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Overview

Unlock limitless possibilities with the LM3S6633-IBZ50-A2T microcontroller by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microcontroller offers unparalleled value, efficiency, and performance. Whether you're a seasoned developer or a hobbyist, the LM3S6633-IBZ50-A2T provides the tools you need to bring your projects to life. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the microcontroller lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures compatibility with a wide range of power sources, making it versatile for different applications.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB and facilitates uniform placement in electronic designs.

Bit Size: 32

The 32-bit size allows for faster and more efficient processing of data, enhancing the overall performance of the microcontroller.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options (2.5 V, 3.3 V) provides flexibility in designing and powering up the microcontroller based system.

No. of Terminals: 108

The 108 terminals offer a wide range of I/O options, enabling connectivity with various external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style enhances thermal performance and facilitates efficient heat dissipation, improving overall reliability.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures stable operation even under low power conditions, making it energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in harsh environmental conditions, enhancing durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the microcontroller can function in extreme cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors, expanding its capabilities for a wide range of applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and component placement, making it easier for manufacturing and assembly processes.

ROM Words: 131072

The large ROM size of 131072 words provides ample storage for program code and data, allowing for complex algorithms and applications to be implemented.

Maximum Seated Height: 1.5 mm

The low maximum seated height of 1.5 mm facilitates slim and compact designs, ideal for space-constrained applications.

Width: 10 mm

The compact width of 10 mm allows for easy integration into smaller electronic devices while conserving valuable PCB real estate.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 32 MHz enables fast processing speeds and real-time responsiveness, suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and rework processes, leading to reliable connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for secure solder joints and stable connections during manufacturing processes.

Length: 10 mm

The compact length of 10 mm contributes to a small form factor design, ideal for applications where space is limited or miniaturization is required.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable performance in harsh operating conditions such as high temperatures and humidity levels.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers high speed and efficiency in data processing, essential for applications requiring quick response times.

RAM Bytes: 32768

The generous RAM size of 32768 bytes provides sufficient memory for temporary data storage and processing, enabling multitasking capabilities.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in electrically noisy environments.

Terminal Form: BALL

The ball terminal form simplifies assembly and rework processes, ensuring reliable connections and ease of handling during production.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides a stable operating voltage for the microcontroller, ensuring consistent performance and reliability.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals, essential for applications such as motor control, LED dimming, and audio modulation.

ROM Programmability: FLASH

The ROM programmability using flash memory allows for easy firmware updates and customization, enhancing flexibility and scalability in product development.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm enables high-density mounting on the PCB, optimizing space usage and improving signal integrity.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the microcontroller's resistance to moisture-induced failures during handling, storage, and assembly.

Speed: 50 rpm

The speed rating of 50 rpm ensures efficient data processing and fast response times, suitable for time-sensitive applications or real-time control systems.

No. of I/O Lines: 41

The 41 I/O lines provide ample input and output options for connecting to various sensors, actuators, and communication interfaces, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers LM3S6633-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S6633-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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