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LM3S6633-EQC50-A2T

Texas Instruments

LM3S6633-EQC50-A2T by Texas Instruments

LM3S6633-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 0.032 MHz, it features 41 I/O lines, PWM channels, and ADC channels. Ideal for industrial applications requiring a temperature range of -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,484 parts In-Stock

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7,484

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Digiode

USA . 1,406 parts In-Stock

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1,406

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One Stop Electronics

USA . 808 parts In-Stock

1+ parts

$7.000

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808

$7.000

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AZTECH Wire

Italy . 713 parts In-Stock

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$7.546

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713

$7.546

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Parana Technologies

USA . 1,611 parts In-Stock

1+ parts

$62.992

100+ parts

$5,849.719

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$56.692

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1,611

$62.992

$5,849.719

$56.692

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DigiPath Technology Company

USA . 184 parts In-Stock

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$69.361

100+ parts

$63.813

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184

$69.361

$63.813

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ChromeModa Solutions

Germany . 4,819 parts In-Stock

1+ parts

$70.777

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$58.037

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4,819

$70.777

$58.037

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IDEA Electronic Components Group

UK . 1,432 parts In-Stock

1+ parts

$70.777

100+ parts

$67.238

1k+ parts

$63.699

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1,432

$70.777

$67.238

$63.699

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Corphita

USA . 3,152 parts In-Stock

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Microchip USA

USA . 143 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S6633-EQC50-A2T microcontroller. Ideal for a wide range of applications, this high-quality device offers customers unparalleled value and benefits. With its advanced features, including 32-bit architecture, FLASH ROM programmability, and 41 I/O lines, this microcontroller provides reliable performance in industrial-grade environments. Trust Texas Instruments for top-notch products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures that the microcontroller operates within safe limits, preventing damage from overvoltage.

Bit Size: 32

32-bit architecture allows for higher processing power and performance, making this microcontroller suitable for complex applications.

Power Supplies (V): 2.5, 3.3

Support for multiple power supplies (2.5V and 3.3V) offers flexibility in design and compatibility with various power sources.

No. of Terminals: 100

With 100 terminals, this microcontroller can accommodate a wide range of input and output connections, enabling versatile connectivity options.

Package Style (Meter): FLATPACK

The flatpack package style provides a low profile design, making it suitable for space-constrained applications where height is a concern.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this microcontroller to function in extreme cold conditions without performance degradation.

ADC Channels: YES

Analog-to-Digital Converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: QUAD

Quad terminal position provides enhanced stability and connectivity, reducing the risk of signal interference and ensuring reliable data transmission.

ROM Words: 131072

With 131072 ROM words, this microcontroller offers ample storage capacity for program memory, allowing for complex code execution and program versatility.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm makes this microcontroller suitable for applications with height restrictions or where a slim profile is desired.

Width: 14 mm

The compact width of 14 mm enables easy integration into designs with limited space, allowing for efficient use of board real estate.

Maximum Clock Frequency: 0.032 MHz

The maximum clock frequency of 0.032 MHz offers high-speed processing capabilities, ensuring rapid data execution and response times.

Length: 14 mm

The short length of 14 mm enhances the microcontroller's versatility in compact designs, fitting into tight spaces without sacrificing performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller can withstand harsh environmental conditions and operate reliably in demanding settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller's peripheral IC offers efficient data processing, reduced power consumption, and improved overall performance.

RAM Bytes: 32768

With 32768 bytes of RAM, this microcontroller can store and manipulate data efficiently, supporting multitasking and handling complex algorithms.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form offers reliable solder joints and mechanical strength, enhancing the microcontroller's durability and long-term performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V provides stable power delivery to the microcontroller, ensuring consistent and reliable operation.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of motor speeds, LED brightness, and other analog functions, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast reprogramming of the microcontroller's memory, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5 mm, this microcontroller offers high-density packaging, enabling compact designs and efficient use of board space.

Speed: 50 rpm

Operating at a speed of 50 rotations per minute, this microcontroller provides rapid data processing for real-time applications and high-speed control tasks.

No. of I/O Lines: 41

With 41 input/output lines, this microcontroller supports versatile communication and connectivity options, enabling interfacing with multiple external devices.

Technical Specifications

Microcontrollers LM3S6633-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

41

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6633-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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