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LM3S6618-EQC50-A2T

Texas Instruments

LM3S6618-EQC50-A2T by Texas Instruments

LM3S6618-EQC50-A2T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 8.192 MHz, it features 38 I/O lines and PWM channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,204 parts In-Stock

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7,204

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Digiode

USA . 253 parts In-Stock

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253

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Distributors (Availability)

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One Stop Electronics

USA . 1,571 parts In-Stock

1+ parts

$1.000

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-

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1,571

$1.000

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AZTECH Wire

Italy . 603 parts In-Stock

1+ parts

$9.897

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603

$9.897

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Parana Technologies

USA . 199 parts In-Stock

1+ parts

$13.558

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$14.062

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199

$13.558

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$14.062

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ChromeModa Solutions

Germany . 4,089 parts In-Stock

1+ parts

$15.234

100+ parts

$12.492

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4,089

$15.234

$12.492

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IDEA Electronic Components Group

UK . 837 parts In-Stock

1+ parts

$15.234

100+ parts

$14.472

1k+ parts

$13.711

10k+ parts

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837

$15.234

$14.472

$13.711

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DigiPath Technology Company

USA . 853 parts In-Stock

1+ parts

-

100+ parts

$13.735

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853

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$13.735

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Corphita

USA . 800 parts In-Stock

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800

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Microchip USA

USA . 290 parts In-Stock

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290

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Overview

Unlock endless possibilities with the LM3S6618-EQC50-A2T by Texas Instruments, a top-notch microcontroller designed to elevate your projects to new heights. Crafted with precision and expertise, Texas Instruments delivers unmatched quality and reliability in every product they create. Whether you're designing smart home devices, automotive systems, or industrial automation solutions, this microcontroller offers exceptional value with its cutting-edge technology and versatile applications. Experience seamless performance, superior functionality, and innovative features that set you apart from the competition. Elevate your projects with the LM3S6618-EQC50-A2T and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the microcontroller, making it durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto circuit boards.

Maximum Supply Voltage: 2.75 V

Operating within a safe maximum supply voltage range ensures the longevity and stability of the microcontroller.

Bit Size: 32

A 32-bit architecture offers higher processing power and efficiency for various applications.

RAM Bytes: 32768

Having a large RAM capacity allows for storing and accessing more data quickly, enhancing the performance of the microcontroller.

Maximum Clock Frequency: 8.192 MHz

A high clock frequency enables fast data processing and execution of instructions, making the microcontroller suitable for tasks that require quick responses.

Technology: CMOS

Complementary metal-oxide-semiconductor technology ensures low power consumption, high noise immunity, and reliability in the microcontroller.

ROM Programmability: FLASH

Flash memory allows for easy and flexible reprogramming of the microcontroller, enabling firmware updates and customization.

Technical Specifications

Microcontrollers LM3S6618-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

38

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6618-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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