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LM3S6611-IQC50-A2

Texas Instruments

LM3S6611-IQC50-A2 by Texas Instruments

Texas Instruments LM3S6611-IQC50-A2 microcontroller features 32-bit CPU, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications, it offers Ethernet connectivity, 4 timers, and low power mode for efficient operation at -40 to 85°C.

Median Price

$57.690

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 3 parts In-Stock

1+ parts

$57.690

100+ parts

$43.270

1k+ parts

$37.500

10k+ parts

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3

$57.690

$43.270

$37.500

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Vyrian

USA . 4,242 parts In-Stock

1+ parts

-

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4,242

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Digiode

USA . 3,729 parts In-Stock

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3,729

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 287 parts In-Stock

1+ parts

$3.000

100+ parts

-

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287

$3.000

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Ampacity Inc.

Singapore . 584 parts In-Stock

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$14.000

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-

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584

$14.000

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AZTECH Wire

Italy . 345 parts In-Stock

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$19.287

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345

$19.287

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Parana Technologies

USA . 1,189 parts In-Stock

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$38.471

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1,189

$38.471

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DigiPath Technology Company

USA . 1,040 parts In-Stock

1+ parts

$42.361

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1,040

$42.361

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ChromeModa Solutions

Germany . 3,969 parts In-Stock

1+ parts

$43.226

100+ parts

$35.445

1k+ parts

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3,969

$43.226

$35.445

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IDEA Electronic Components Group

UK . 2,269 parts In-Stock

1+ parts

$43.226

100+ parts

$41.065

1k+ parts

$38.903

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2,269

$43.226

$41.065

$38.903

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,230 parts In-Stock

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2,230

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Microchip USA

USA . 202 parts In-Stock

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202

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Overview

Elevate your projects with the LM3S6611-IQC50-A2 microcontroller by Texas Instruments, a powerhouse of innovation and reliability. Designed with cutting-edge technology, this device offers seamless integration, high performance, and low power consumption, making it ideal for a wide range of applications. Whether you're working on industrial automation, consumer electronics, or IoT devices, this microcontroller delivers unmatched value and efficiency. Trust in Texas Instruments' legacy of excellence and elevate your designs to the next level with the LM3S6611-IQC50-A2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for more power to be delivered to the microcontroller, enhancing its performance.

On Chip Data RAM Width: 8

The wider data RAM width allows for faster data processing and storage capabilities.

CPU Family: CORTEX-M3

Being part of the CORTEX-M3 family ensures that the microcontroller has a strong and reliable processing core.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions.

ROM Programmability: FLASH

Flash ROM allows for easy and quick reprogramming of the microcontroller, making it versatile for different applications.

Connectivity: ETHERNET, I2C(2), SSI(2), UART(3)

Multiple connectivity options make it easier to integrate the microcontroller into various systems and networks.

Technical Specifications

Microcontrollers LM3S6611-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

63

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(2), SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S6611-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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