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LM3S6611-IBZ50-A2

Texas Instruments

LM3S6611-IBZ50-A2 by Texas Instruments

Texas Instruments LM3S6611-IBZ50-A2 microcontroller features 32-bit Cortex-M3 CPU, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications, it offers Ethernet connectivity, 4 timers, and low power mode for efficient operation at temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 9,853 parts In-Stock

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Digiode

USA . 1,155 parts In-Stock

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Sternenhof Electronics

Switzerland . 172 parts In-Stock

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172

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One Stop Electronics

USA . 1,063 parts In-Stock

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$2.000

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$2.000

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AZTECH Wire

Italy . 623 parts In-Stock

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$14.233

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623

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Parana Technologies

USA . 1,847 parts In-Stock

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$22.650

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$2,103.442

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$20.385

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1,847

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$2,103.442

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DigiPath Technology Company

USA . 1,695 parts In-Stock

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$24.941

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$24.941

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ChromeModa Solutions

Germany . 6,705 parts In-Stock

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$25.450

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$20.869

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6,705

$25.450

$20.869

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IDEA Electronic Components Group

UK . 2,205 parts In-Stock

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$25.450

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$24.178

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$22.905

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2,205

$25.450

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$22.905

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Component Stockers USA

USA . 367 parts In-Stock

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$99.990

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Corphita

USA . 600 parts In-Stock

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Microchip USA

USA . 174 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S6611-IBZ50-A2 by Texas Instruments. This high-quality microcontroller offers unparalleled performance and reliability, making it ideal for a wide range of applications. With advanced features like integrated cache and low power mode, this product provides exceptional value and benefits to customers. Trust in Texas Instruments' reputation for excellence and innovation, and revolutionize your projects with the LM3S6611-IBZ50-A2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the microcontroller lightweight and durable, suitable for portable or rugged applications.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microcontroller by reducing access times to frequently used data and instructions.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V allows for efficient power consumption and operation within specified voltage limits, ensuring device reliability.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, the microcontroller can efficiently handle and process data in smaller chunks, enhancing overall system performance.

Package Shape: SQUARE

The square package shape of the microcontroller saves space and allows for easier integration into compact electronic designs or PCB layouts.

Bit Size: 32

The 32-bit architecture of the microcontroller provides enhanced computational power and efficiency, making it suitable for handling complex tasks and applications.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options at 2.5V and 3.3V ensures compatibility with various voltage requirements of external components, simplifying system integration.

No. of Terminals: 108

With 108 terminals, the microcontroller offers ample connectivity options for interfacing with external devices or peripherals, enabling versatile applications.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures stable operation and prevents voltage drops, enhancing the reliability and longevity of the microcontroller.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the microcontroller to operate efficiently in industrial or harsh environments without compromising performance.

CPU Family: CORTEX-M3

Belonging to the Cortex-M3 family, the microcontroller offers a balance of performance and power efficiency, making it suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold environments or outdoor applications, making the microcontroller versatile in various conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and oxidation resistance, improving signal transmission and overall reliability of the microcontroller.

Terminal Position: BOTTOM

Having the terminals located at the bottom simplifies PCB assembly and enhances thermal dissipation, contributing to improved reliability and ease of installation.

ROM Words: 131072

With a ROM capacity of 131072 words, the microcontroller can store a large amount of program code or data, enabling the execution of complex algorithms and applications.

Maximum Seated Height: 1.5 mm

The compact maximum seated height of 1.5mm enables the microcontroller to be used in space-constrained designs or applications with strict form factor requirements.

Width: 10 mm

The narrow width of 10mm makes the microcontroller suitable for applications where space-saving is crucial, allowing for dense packing on PCBs or small electronic devices.

Boundary Scan: YES

Support for boundary scan feature facilitates testing and diagnosis of the microcontroller during production or debugging, ensuring reliable operation and easier maintenance.

Peripherals: TIMER(4), WDT

The inclusion of 4 timer peripherals and a watchdog timer enhances the microcontroller's ability to handle time-critical tasks and maintain system integrity, making it suitable for real-time applications.

Maximum Clock Frequency: 0.032 MHz

With a maximum clock frequency of 32 MHz, the microcontroller offers fast processing speeds and efficient execution of instructions, ideal for demanding applications that require high performance.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperature for 30 seconds ensures reliable soldering during manufacturing and assembly processes, improving product quality and longevity.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering of the microcontroller onto PCBs, ensuring strong mechanical connections and reliable electrical contact.

Length: 10 mm

The compact length of 10mm contributes to the microcontroller's overall small footprint and compatibility with space-constrained designs or devices requiring high-density integration.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the microcontroller is capable of operating reliably in harsh environments with extended temperature ranges, ensuring consistent performance in demanding settings.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller with RISC architecture, it offers efficient processing capabilities, reduced power consumption, and streamlined instruction execution, making it suitable for embedded control applications.

No. of Timers: 4

Having 4 timer peripherals allows for precise timing and scheduling of tasks within the microcontroller, enabling the implementation of time-critical operations in various applications.

RAM Bytes: 32768

With a RAM capacity of 32768 bytes, the microcontroller can efficiently store and manipulate data during runtime, facilitating smooth operation and data processing in diverse applications.

Technology: CMOS

Utilizing CMOS technology, the microcontroller offers low power consumption, high noise immunity, and reliable performance, making it well-suited for battery-powered or energy-efficient applications.

Terminal Form: BALL

Featuring terminal balls for connection, the microcontroller offers improved electrical contact, thermal dissipation, and mechanical strength, ensuring reliable operation in various mounting configurations.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V provides a stable operating voltage for the microcontroller, ensuring consistent performance and preventing voltage-related issues in the system.

No. of Serial I/Os: 8

With 8 serial I/O lines, the microcontroller can communicate with multiple external devices or peripherals simultaneously, enabling efficient data exchange and interfacing in complex systems.

PWM Channels: YES

Support for PWM channels allows the microcontroller to generate precise digital signals for controlling analog devices, enabling accurate modulation and control of various output parameters.

Connectivity: ETHERNET, I2C(2), SSI(2), UART(3)

Featuring Ethernet, I2C, SSI, and UART interfaces, the microcontroller offers versatile connectivity options for networking, sensor integration, and serial communication, enhancing its compatibility with diverse applications.

ROM Programmability: FLASH

With flash programmability, the microcontroller supports flexible and efficient programming of code and data, allowing for easy updates, customization, and reconfiguration of the device in the field.

Terminal Pitch: 0.8 mm

The narrow terminal pitch of 0.8mm enables high-density packaging of the microcontroller on PCBs, facilitating compact design layouts and efficient use of space in electronic applications.

Format: FIXED POINT

Utilizing a fixed-point format for numerical representation, the microcontroller offers efficient arithmetic operations, reduced computational complexity, and optimized performance for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the microcontroller can withstand moderate exposure to moisture during storage or assembly processes, ensuring long-term reliability and performance in varied environmental conditions.

Speed: 50 rpm

The microcontroller's speed of 50 rpm refers to its processing capabilities and execution speed, allowing for efficient task handling and operation in real-time or time-sensitive applications.

Technical Specifications

Microcontrollers LM3S6611-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

46

No. of Serial I/Os:

8

No. of Terminals:

108

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(2), SSI(2), UART(3)

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S6611-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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