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LM3S6610-IQC25-A2T

Texas Instruments

LM3S6610-IQC25-A2T by Texas Instruments

Texas Instruments LM3S6610-IQC25-A2T is a 32-bit microcontroller with 131072 ROM words, 32768 RAM bytes, and 46 I/O lines. Operating at up to 0.032 MHz clock frequency, it is ideal for industrial applications requiring a wide temperature range from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,082 parts In-Stock

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Digiode

USA . 348 parts In-Stock

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348

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Distributors (Availability)

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AZTECH Wire

Italy . 238 parts In-Stock

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$8.193

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238

$8.193

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One Stop Electronics

USA . 561 parts In-Stock

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$26.000

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561

$26.000

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Parana Technologies

USA . 2,017 parts In-Stock

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$64.885

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$64.885

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

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$72.905

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$69.260

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$65.614

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1,848

$72.905

$69.260

$65.614

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ChromeModa Solutions

Germany . 1,805 parts In-Stock

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$72.905

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$59.782

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$72.905

$59.782

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QUARKTWIN TECHNOLOGY LTD

USA . 22,891 parts In-Stock

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Corphita

USA . 4,386 parts In-Stock

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DigiPath Technology Company

USA . 1,136 parts In-Stock

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$65.731

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Microchip USA

USA . 220 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S6610-IQC25-A2T microcontroller from Texas Instruments. This powerful device offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. Whether you're working on industrial automation, consumer electronics, or automotive systems, this microcontroller delivers exceptional performance and versatility. Trust in Texas Instruments' reputation for excellence and innovation, and experience the value and benefits that the LM3S6610-IQC25-A2T brings to your projects. Elevate your designs with this cutting-edge solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Allows for easy assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 2.75 V

Ensures safe operation within specified voltage limits, protecting the product from damage.

Package Shape: SQUARE

Helps in efficient space utilization on the circuit board, making the product compact.

Bit Size: 32

Provides high computational capabilities, allowing for complex calculations and processing tasks.

Power Supplies (V): 2.5,3.3

Offers flexibility in power input options, enabling compatibility with different power sources.

No. of Terminals: 100

Provides multiple connection points for interfacing with other components, enhancing the versatility of the product.

Package Style (Meter): FLATPACK

Facilitates easy integration into existing systems, simplifying the upgrade or replacement process.

Minimum Supply Voltage: 2.25 V

Ensures reliable operation even under low voltage conditions, enhancing the product's performance in various scenarios.

Maximum Operating Temperature: 85 °C

Supports operation in high-temperature environments without compromising performance or reliability.

Minimum Operating Temperature: -40 °C

Allows the product to function in extremely cold conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN

Provides corrosion resistance and ensures secure electrical connections, increasing the product's longevity.

ADC Channels: YES

Enables analog-to-digital conversion, allowing the product to interface with analog sensors or devices.

Terminal Position: QUAD

Facilitates easy connection and installation of the product onto the circuit board, streamlining the manufacturing process.

ROM Words: 131072

Provides ample storage for program instructions and data, accommodating complex applications and functionalities.

Maximum Seated Height: 1.6 mm

Ensures a low-profile design, reducing the overall size of the product and making it suitable for compact devices.

Width: 14 mm

Offers a compact form factor, enabling the product to be used in space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

Supports fast data processing and communication speeds, enhancing the product's performance capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for proper soldering during assembly, ensuring reliable connections and functionality.

Peak Reflow Temperature °C: 260

Facilitates the soldering process, providing secure connections for the product's components.

Length: 14 mm

Contributes to the compact design of the product, making it suitable for small-scale applications.

Temperature Grade: INDUSTRIAL

Designed to operate in harsh industrial environments, ensuring durability and reliability in challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing, enabling high-speed operation and responsiveness.

RAM Bytes: 32768

Provides sufficient memory for temporary data storage, facilitating multitasking and complex processing tasks.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing the product's efficiency.

Terminal Form: GULL WING

Facilitates surface mounting onto circuit boards, enabling a reliable and secure connection.

Nominal Supply Voltage: 2.5 V

Specifies the standard operating voltage for the product, ensuring proper performance and reliability.

PWM Channels: YES

Supports pulse-width modulation, allowing for precise control of connected devices or components.

ROM Programmability: FLASH

Enables reprogramming of the ROM memory, providing flexibility for future updates or modifications.

Terminal Pitch: 0.5 mm

Specifies the distance between terminals, ensuring compatibility with standard PCB layouts and assembly processes.

Moisture Sensitivity Level (MSL): 3

Indicates the product's sensitivity to moisture during storage and handling, ensuring proper precautions are taken.

Speed: 25 rpm

Specifies the rotational speed for specific applications, ensuring compatibility with motor control or speed regulation requirements.

No. of I/O Lines: 46

Provides sufficient input/output connections for interfacing with external devices or peripherals, enhancing the product's connectivity.

Technical Specifications

Microcontrollers LM3S6610-IQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6610-IQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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