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LM3S6610-IQC25-A2

Texas Instruments

LM3S6610-IQC25-A2 by Texas Instruments

Texas Instruments LM3S6610-IQC25-A2 microcontroller features 32-bit Cortex-M3 CPU, 131072 ROM words, and 32768 RAM bytes. Ideal for industrial applications with Ethernet connectivity, it offers low power mode and 4 timers for precise control in a compact square package.

Median Price

$32.018

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$28.460

1k+ parts

$25.470

10k+ parts

$23.970

60

-

$28.460

$25.470

$23.970

DigiKey

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60

-

-

-

-

Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$35.575

1k+ parts

$31.837

10k+ parts

$29.962

60

-

$35.575

$31.837

$29.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,543 parts In-Stock

1+ parts

$26.125

100+ parts

-

1k+ parts

-

10k+ parts

-

4,543

$26.125

-

-

-

Vyrian

USA . 2,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,811

-

-

-

-

DigiKey Marketplace

USA . 170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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170

-

-

-

-

LWI Electronics Inc

India . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,144 parts In-Stock

1+ parts

$24.750

100+ parts

-

1k+ parts

-

10k+ parts

-

2,144

$24.750

-

-

-

Parana Technologies

USA . 1,147 parts In-Stock

1+ parts

$50.714

100+ parts

-

1k+ parts

-

10k+ parts

-

1,147

$50.714

-

-

-

ChromeModa Solutions

Germany . 2,174 parts In-Stock

1+ parts

$56.982

100+ parts

$46.725

1k+ parts

-

10k+ parts

-

2,174

$56.982

$46.725

-

-

IDEA Electronic Components Group

UK . 1,137 parts In-Stock

1+ parts

$56.982

100+ parts

$54.133

1k+ parts

$51.284

10k+ parts

-

1,137

$56.982

$54.133

$51.284

-

Microchip USA

USA . 1,021 parts In-Stock

1+ parts

$65.800

100+ parts

$64.660

1k+ parts

$64.090

10k+ parts

$63.510

1,021

$65.800

$64.660

$64.090

$63.510

QUARKTWIN TECHNOLOGY LTD

USA . 20,131 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20,131

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-

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DigiPath Technology Company

USA . 404 parts In-Stock

1+ parts

-

100+ parts

$51.375

1k+ parts

-

10k+ parts

-

404

-

$51.375

-

-

Overview

Unleash the power of innovation with the LM3S6610-IQC25-A2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Ideal for a wide range of applications, this microcontroller offers advanced features such as integrated cache, low power mode, and multiple connectivity options. With a focus on performance and efficiency, the LM3S6610-IQC25-A2 provides exceptional value and benefits to customers looking to elevate their projects to the next level. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microcontroller a reliable and affordable choice.

Integrated Cache: YES

The integrated cache helps in improving the performance and efficiency of the microcontroller by reducing the access time to frequently used instructions or data.

Maximum Supply Voltage: 2.75 V

Operating at a maximum supply voltage of 2.75 V ensures compatibility with a wide range of power sources and allows for efficient power management.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures high performance and energy efficiency for the microcontroller, making it suitable for a variety of applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, enabling it to interface with sensors and other analog devices.

ROM Words: 131072

With a large ROM (Read-Only Memory) capacity of 131072 words, the microcontroller can store a significant amount of program instructions and data.

Connectivity: ETHERNET, I2C, SSI, UART(3)

The various connectivity options provided such as Ethernet, I2C, SSI, and UART enable the microcontroller to communicate with other devices and networks, enhancing its versatility.

Speed: 50 rpm

Operating at a speed of 50 RPM, this microcontroller can efficiently execute instructions and tasks, making it suitable for applications requiring precise timing.

Technical Specifications

Microcontrollers LM3S6610-IQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

46

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C, SSI, UART(3)

Peripherals:

TIMER(4), WDT

Trade Compliance

LM3S6610-IQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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