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LM3S6537-IBZ50-A2

Texas Instruments

LM3S6537-IBZ50-A2 by Texas Instruments

Texas Instruments' LM3S6537-IBZ50-A2 is a 32-bit microcontroller with 108 terminals, operating at up to 50 MHz. It features 65KB RAM, Flash ROM programmability, and ADC channels. Ideal for industrial applications requiring a reliable microcontroller with PWM capabilities and a wide temperature range from -40°C to 85°C.

Median Price

$14.530

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,312 parts In-Stock

1+ parts

$14.530

100+ parts

$14.240

1k+ parts

$13.950

10k+ parts

-

3,312

$14.530

$14.240

$13.950

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,263

-

-

-

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Digiode

USA . 2,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,328

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 779 parts In-Stock

1+ parts

$7.653

100+ parts

-

1k+ parts

-

10k+ parts

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779

$7.653

-

-

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One Stop Electronics

USA . 448 parts In-Stock

1+ parts

$16.000

100+ parts

-

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448

$16.000

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Parana Technologies

USA . 1,002 parts In-Stock

1+ parts

$24.884

100+ parts

-

1k+ parts

$25.577

10k+ parts

-

1,002

$24.884

-

$25.577

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DigiPath Technology Company

USA . 1,732 parts In-Stock

1+ parts

$27.400

100+ parts

$25.208

1k+ parts

-

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-

1,732

$27.400

$25.208

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ChromeModa Solutions

Germany . 1,580 parts In-Stock

1+ parts

$27.959

100+ parts

$22.926

1k+ parts

-

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1,580

$27.959

$22.926

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

1+ parts

$27.959

100+ parts

$26.561

1k+ parts

$25.163

10k+ parts

-

1,040

$27.959

$26.561

$25.163

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Microchip USA

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Kepictronics

USA . 3,312 parts In-Stock

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3,312

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Corphita

USA . 2,855 parts In-Stock

1+ parts

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2,855

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Overview

Unlock the power of innovation with the LM3S6537-IBZ50-A2 microcontroller from Texas Instruments. Designed to deliver exceptional performance and reliability, this cutting-edge technology opens up a world of possibilities for various applications. Whether you're looking to enhance your automation systems, IoT devices, or consumer electronics, this versatile microcontroller offers unmatched value, efficiency, and flexibility. Trust in Texas Instruments' reputation for excellence and choose the LM3S6537-IBZ50-A2 for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, facilitating the assembly process.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75 V ensures the safety and longevity of the microcontroller.

Package Shape: SQUARE

Square package shape enables efficient use of PCB space and facilitates placement within electronic devices.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and data processing tasks effectively.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages (2.5V and 3.3V) adds flexibility in system design and integration.

No. of Terminals: 108

Having 108 terminals allows for a wide range of connectivity options and peripherals to be interfaced with the microcontroller.

Package Style (Meter): GRID ARRAY

Grid array package style offers increased reliability and robustness during PCB mounting and soldering processes.

Minimum Supply Voltage: 2.25 V

Operating at a minimum supply voltage of 2.25 V ensures efficient power consumption and performance of the microcontroller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the microcontroller can function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures the microcontroller can handle extreme cold conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, enhancing the reliability of connections.

ADC Channels: YES

Integrated analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its applicability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing signal integrity and reducing interference.

ROM Words: 98304

With a ROM size of 98304 words, the microcontroller can store a large amount of program instructions and data for efficient operation.

Maximum Seated Height: 1.5 mm

A low maximum seated height of 1.5 mm allows for compact device designs and slim form factors.

Width: 10 mm

Slim width of 10 mm enables the microcontroller to be used in space-constrained applications without compromising on performance.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50 MHz, the microcontroller can execute instructions quickly and handle real-time processing tasks efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can be securely soldered onto PCBs without risk of damage.

Length: 10 mm

Compact length of 10 mm enables space-saving integration of the microcontroller in various electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the microcontroller can operate reliably in harsh environmental conditions and high-temperature settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a Reduced Instruction Set Computing (RISC) architecture, the microcontroller offers high performance, low power consumption, and efficient execution of instructions.

RAM Bytes: 65536

With a large RAM size of 65536 bytes, the microcontroller can efficiently manage data storage and processing tasks for complex applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption, high noise immunity, and reliable operation of the microcontroller.

Terminal Form: BALL

Ball terminal form simplifies the soldering and mounting process, enhancing the reliability and connection integrity of the microcontroller.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5 V ensures efficient power utilization and stable performance of the microcontroller.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels allows the microcontroller to generate precise digital signals for controlling motors, LEDs, and other devices.

ROM Programmability: FLASH

Flash ROM programmability enables easy and fast updates to the microcontroller's firmware, facilitating customization and adaptability of the device.

Terminal Pitch: 0.8 mm

A small terminal pitch of 0.8 mm enhances the connectivity density and integration capabilities of the microcontroller on PCBs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microcontroller can withstand standard moisture exposure levels during storage and PCB assembly.

Speed: 50 rpm

Operating at a speed of 50 revolutions per minute (rpm), the microcontroller can handle real-time control and monitoring applications effectively.

No. of I/O Lines: 41

Having 41 I/O lines offers sufficient connectivity options for interfacing with external devices, sensors, and communication peripherals.

Technical Specifications

Microcontrollers LM3S6537-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S6537-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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