Loading...

LM3S6432-IBZ50-A2

Texas Instruments

LM3S6432-IBZ50-A2 by Texas Instruments

Texas Instruments LM3S6432-IBZ50-A2 is a 32-bit microcontroller with Cortex-M3 CPU, 32768 bytes RAM, and 98304 ROM words. It features 3 ADC channels, PWM(2), TIMER(3), WDT peripherals, and connectivity options like Ethernet and UART. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85 °C, and integrated cache for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,907

-

-

-

-

Vyrian

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,360

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 552 parts In-Stock

1+ parts

$15.294

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$15.294

-

-

-

One Stop Electronics

USA . 732 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

-

732

$19.000

-

-

-

Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$25.577

100+ parts

$25.322

1k+ parts

$24.299

10k+ parts

-

800

$25.577

$25.322

$24.299

-

Parana Technologies

USA . 273 parts In-Stock

1+ parts

$76.705

100+ parts

-

1k+ parts

-

10k+ parts

-

273

$76.705

-

-

-

DigiPath Technology Company

USA . 121 parts In-Stock

1+ parts

$84.461

100+ parts

-

1k+ parts

-

10k+ parts

-

121

$84.461

-

-

-

IDEA Electronic Components Group

UK . 2,151 parts In-Stock

1+ parts

$86.185

100+ parts

$81.876

1k+ parts

$77.566

10k+ parts

-

2,151

$86.185

$81.876

$77.566

-

ChromeModa Solutions

Germany . 1,206 parts In-Stock

1+ parts

$86.185

100+ parts

$70.672

1k+ parts

-

10k+ parts

-

1,206

$86.185

$70.672

-

-

Kepictronics

USA . 21,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,500

-

-

-

-

Corphita

USA . 4,289 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,289

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Microchip USA

USA . 198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

198

-

-

-

-

Overview

Unlocking endless possibilities in the world of technology, the LM3S6432-IBZ50-A2 by Texas Instruments is a game-changer in the realm of microcontrollers. With top-notch quality and reliability from a trusted manufacturer like Texas Instruments, this device opens doors to innovative applications in various industries. Offering unmatched value, benefits, and advantages to customers, this microcontroller boasts integrated cache, multiple power supplies, and an array of peripherals including PWM and timers. Explore the limitless potential of the LM3S6432-IBZ50-A2 and revolutionize your projects with cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microcontroller.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options for the microcontroller.

CPU Family: CORTEX-M3

The Cortex-M3 family is known for its performance and power efficiency, making it a reliable choice for microcontroller applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to accurately convert analog signals to digital data for processing.

ROM Programmability: FLASH

Using Flash ROM allows for easy and efficient programming of the microcontroller, making it versatile for different applications.

Connectivity: ETHERNET, I2C, SSI, UART

Multiple connectivity options such as Ethernet, I2C, SSI and UART provide versatility in communication interfaces for the microcontroller.

Speed: 50 rpm

The operational speed of 50 rpm ensures efficient processing and response times for the microcontroller.

Low Power Mode: YES

The inclusion of a low power mode helps in reducing power consumption and extending the battery life of devices using this microcontroller.

Technical Specifications

Microcontrollers LM3S6432-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Serial I/Os:

3

No. of Terminals:

108

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C, SSI, UART

Peripherals:

PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

LM3S6432-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20