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LM3S6422-IQC25-A2T

Texas Instruments

LM3S6422-IQC25-A2T by Texas Instruments

Texas Instruments' LM3S6422-IQC25-A2T is a 32-bit microcontroller with 32768 RAM bytes and 98304 ROM words. Operating at -40 to 85 °C, it has PWM channels, ADC channels, and 34 I/O lines for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,308 parts In-Stock

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3,308

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Vyrian

USA . 3,067 parts In-Stock

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3,067

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Distributors (Availability)

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One Stop Electronics

USA . 1,504 parts In-Stock

1+ parts

$8.000

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1,504

$8.000

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AZTECH Wire

Italy . 431 parts In-Stock

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$9.999

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431

$9.999

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Ampacity Inc.

Singapore . 1,499 parts In-Stock

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$23.000

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1,499

$23.000

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Parana Technologies

USA . 1,361 parts In-Stock

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$47.632

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1,361

$47.632

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DigiPath Technology Company

USA . 1,995 parts In-Stock

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$52.449

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1,995

$52.449

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ChromeModa Solutions

Germany . 5,324 parts In-Stock

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$53.519

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$43.886

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5,324

$53.519

$43.886

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IDEA Electronic Components Group

UK . 147 parts In-Stock

1+ parts

$53.519

100+ parts

$50.843

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$48.167

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147

$53.519

$50.843

$48.167

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Corphita

USA . 3,019 parts In-Stock

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Microchip USA

USA . 344 parts In-Stock

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344

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Overview

Unleash the power of cutting-edge technology with the LM3S6422-IQC25-A2T microcontroller by Texas Instruments. Crafted with precision and expertise, this device is designed to deliver top-notch performance and reliability in various applications. Whether you're working on IoT projects, robotics, or industrial automation, this microcontroller offers unmatched value, efficiency, and flexibility. Elevate your projects to new heights with the LM3S6422-IQC25-A2T and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good durability and ensures the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy integration into printed circuit boards, saving space and making the overall design more compact.

Maximum Supply Voltage: 2.75 V

Operates at a maximum supply voltage of 2.75V, ensuring compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy placement in the circuit layout.

Bit Size: 32

32-bit architecture provides high processing power and performance for demanding applications.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, offering flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 100

With 100 terminals, this microcontroller offers ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK

Flatpack package style ensures easy and secure mounting on PCBs, enhancing overall reliability.

Minimum Supply Voltage: 2.25 V

Operates reliably at a minimum supply voltage of 2.25V, providing stable performance even under low power conditions.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, making it suitable for industrial applications with demanding environmental conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can function efficiently even in extremely cold environments.

Terminal Finish: TIN

Tin terminal finish ensures good electrical conductivity and corrosion resistance, enhancing the overall reliability of the product.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making this microcontroller suitable for applications requiring analog-to-digital conversion.

Terminal Position: QUAD

Quad terminal position provides mechanical stability and ease of soldering, ensuring reliable connections in the circuit.

ROM Words: 98304

Large ROM size of 98304 words allows for extensive program storage, accommodating complex software requirements.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6mm enables compact design and efficient use of vertical space on the PCB.

Width: 14 mm

Compact width of 14mm allows for efficient placement on the circuit board, saving space and facilitating board layout.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32MHz enables fast processing speeds, suitable for real-time applications with strict timing requirements.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm enables high-density mounting on the PCB, supporting compact and miniaturized designs.

No. of I/O Lines: 34

With 34 I/O lines, this microcontroller offers sufficient interfacing capabilities for connecting with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6422-IQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6422-IQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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