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LM3S6422-IQC25-A2

Texas Instruments

LM3S6422-IQC25-A2 by Texas Instruments

LM3S6422-IQC25-A2 by Texas Instruments is a 32-bit microcontroller with 32768 RAM bytes and 98304 ROM words. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC functionality. With a temperature range from -40 to 85 °C, it offers versatile performance in various electronic systems.

Median Price

$16.222

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$14.420

1k+ parts

$12.900

10k+ parts

$12.140

90

-

$14.420

$12.900

$12.140

Verical

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$18.025

1k+ parts

$16.125

10k+ parts

$15.175

90

-

$18.025

$16.125

$15.175

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,553 parts In-Stock

1+ parts

$15.219

100+ parts

-

1k+ parts

-

10k+ parts

-

2,553

$15.219

-

-

-

Vyrian

USA . 4,354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,354

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 189 parts In-Stock

1+ parts

$10.740

100+ parts

-

1k+ parts

-

10k+ parts

-

189

$10.740

-

-

-

Corphita

USA . 800 parts In-Stock

1+ parts

$14.418

100+ parts

-

1k+ parts

-

10k+ parts

-

800

$14.418

-

-

-

Parana Technologies

USA . 2,027 parts In-Stock

1+ parts

$73.007

100+ parts

-

1k+ parts

-

10k+ parts

-

2,027

$73.007

-

-

-

DigiPath Technology Company

USA . 1,465 parts In-Stock

1+ parts

$80.389

100+ parts

-

1k+ parts

-

10k+ parts

-

1,465

$80.389

-

-

-

ChromeModa Solutions

Germany . 5,146 parts In-Stock

1+ parts

$82.030

100+ parts

$67.265

1k+ parts

-

10k+ parts

-

5,146

$82.030

$67.265

-

-

IDEA Electronic Components Group

UK . 1,250 parts In-Stock

1+ parts

$82.030

100+ parts

$77.928

1k+ parts

$73.827

10k+ parts

-

1,250

$82.030

$77.928

$73.827

-

Microchip USA

USA . 455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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455

-

-

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Overview

Experience the power of innovation with the LM3S6422-IQC25-A2 microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This microcontroller offers versatile applications in various industries, providing seamless integration and exceptional performance. With features like high-speed processing and low power consumption, the LM3S6422-IQC25-A2 delivers unmatched value and efficiency to customers. Stay ahead of the competition and elevate your projects with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and increasing production efficiency.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75V ensures compatibility with low power consumption and voltage requirements.

Bit Size: 32

32-bit architecture provides high processing power and efficiency for handling complex tasks and applications.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply options allows for flexibility in system design and integration.

No. of Terminals: 100

Having 100 terminals enables connectivity to various components and peripherals, expanding the capabilities of the microcontroller.

Minimum Operating Temperature: -40 °C

Ability to operate at very low temperatures ensures reliability and functionality in harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels enhance the microcontroller's ability to interface with analog sensors and signals, expanding its potential applications.

ROM Words: 98304

Large ROM capacity of 98304 words allows for storing and executing complex programs and algorithms efficiently.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 32 MHz ensures fast processing speed and real-time performance for time-critical applications.

RAM Bytes: 32768

Ample RAM capacity of 32768 bytes enables efficient data storage and manipulation, improving overall performance.

Technical Specifications

Microcontrollers LM3S6422-IQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6422-IQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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