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LM3S6420-IQC25-A2T

Texas Instruments

LM3S6420-IQC25-A2T by Texas Instruments

LM3S6420-IQC25-A2T by Texas Instruments is a 32-bit microcontroller with 32768 bytes of RAM and 98304 ROM words. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC functionality. With a temperature range from -40 to 85 °C, it offers versatile performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,437 parts In-Stock

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5,437

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Digiode

USA . 563 parts In-Stock

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563

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Distributors (Availability)

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One Stop Electronics

USA . 214 parts In-Stock

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$12.000

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214

$12.000

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AZTECH Wire

Italy . 605 parts In-Stock

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$17.437

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605

$17.437

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Parana Technologies

USA . 885 parts In-Stock

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$55.835

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885

$55.835

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DigiPath Technology Company

USA . 1,963 parts In-Stock

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$61.481

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1,963

$61.481

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ChromeModa Solutions

Germany . 2,667 parts In-Stock

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$62.736

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$51.444

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2,667

$62.736

$51.444

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IDEA Electronic Components Group

UK . 1,098 parts In-Stock

1+ parts

$62.736

100+ parts

$59.599

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$56.462

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1,098

$62.736

$59.599

$56.462

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Component Stockers USA

USA . 634 parts In-Stock

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$99.990

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634

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Microchip USA

USA . 4,141 parts In-Stock

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Corphita

USA . 1,022 parts In-Stock

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Overview

Experience the power of innovation with the LM3S6420-IQC25-A2T microcontroller by Texas Instruments. Crafted with precision and quality, this advanced device opens up a world of possibilities in various applications. From industrial automation to consumer electronics, this microcontroller offers unmatched performance and reliability. With a focus on efficiency and functionality, Texas Instruments delivers a cutting-edge solution that brings value and benefits to customers seeking top-notch technology. Upgrade your projects with the LM3S6420-IQC25-A2T and unleash the true potential of your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the microcontroller on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and prevents damage to the microcontroller from overvoltage.

Bit Size: 32

A 32-bit microcontroller offers high computational power and performance, making it suitable for a wide range of applications.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages (2.5V and 3.3V) allows flexibility in designing and integrating the microcontroller into various systems.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with external devices and components.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C ensures reliable performance in harsh environments or extreme conditions.

ADC Channels: YES

Analog-to-Digital Converter (ADC) channels enable the microcontroller to process analog signals, making it suitable for sensor interfacing and data acquisition.

ROM Words: 98304

The large ROM size of 98304 words provides ample memory for storing program code and data, accommodating complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller ensures efficient execution of instructions, enhancing overall system performance.

Technical Specifications

Microcontrollers LM3S6420-IQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6420-IQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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