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LM3S628-IQN50-C2T

Texas Instruments

LM3S628-IQN50-C2T by Texas Instruments

Texas Instruments' LM3S628-IQN50-C2T is a 32-bit microcontroller with 48 terminals, operating at a max frequency of 0.032 MHz. Ideal for industrial applications, it features 8192 bytes of RAM, FLASH ROM programmability, and PWM channels for precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,029 parts In-Stock

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6,029

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Digiode

USA . 1,925 parts In-Stock

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1,925

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Distributors (Availability)

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AZTECH Wire

Italy . 453 parts In-Stock

1+ parts

$10.659

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453

$10.659

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One Stop Electronics

USA . 1,211 parts In-Stock

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$16.000

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$16.000

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Microchip USA

USA . 3,586 parts In-Stock

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$23.590

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$23.440

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$23.370

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$23.300

3,586

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$23.440

$23.370

$23.300

Parana Technologies

USA . 958 parts In-Stock

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$34.844

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958

$34.844

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ChromeModa Solutions

Germany . 6,987 parts In-Stock

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$39.150

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$32.103

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6,987

$39.150

$32.103

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IDEA Electronic Components Group

UK . 824 parts In-Stock

1+ parts

$39.150

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$37.192

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$35.235

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824

$39.150

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$35.235

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Corphita

USA . 2,492 parts In-Stock

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DigiPath Technology Company

USA . 1,756 parts In-Stock

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$35.298

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$35.298

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Overview

Elevate your projects with the LM3S628-IQN50-C2T by Texas Instruments, a top-tier microcontroller that promises reliability and performance. Crafted by industry leaders, this device ensures high-quality standards and unmatched precision. Ideal for a wide range of applications, this microcontroller offers seamless integration and efficient operation. Experience the value of cutting-edge technology combined with user-friendly features, providing you with endless possibilities for innovation. Upgrade your projects today with the LM3S628-IQN50-C2T and witness the difference quality makes in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility in power supply options.

Bit Size: 32

Offers advanced processing capabilities and can handle complex operations efficiently.

No. of Terminals: 48

Provides a sufficient number of connection points for various input and output interfaces.

RAM Bytes: 8192

Offers ample memory for storing data and executing programs efficiently.

Maximum Clock Frequency: 0.032 MHz

Supports high-speed operation for quick processing of instructions.

ROM Programmability: FLASH

Allows for easy reprogramming of the ROM memory, enabling flexibility in software updates and customization.

Technical Specifications

Microcontrollers LM3S628-IQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S628-IQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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