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LM3S628-EGZ50-C2

Texas Instruments

LM3S628-EGZ50-C2 by Texas Instruments

LM3S628-EGZ50-C2 by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 32768 ROM words, and 8192 RAM bytes. It operates in industrial temperatures from -40 to 105°C, suitable for applications requiring high-speed processing and PWM control with up to 28 I/O lines.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,976 parts In-Stock

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Digiode

USA . 940 parts In-Stock

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AZTECH Wire

Italy . 731 parts In-Stock

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$6.487

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731

$6.487

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Parana Technologies

USA . 2,144 parts In-Stock

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$23.682

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$24.308

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DigiPath Technology Company

USA . 2,227 parts In-Stock

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$26.077

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$23.991

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$26.077

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ChromeModa Solutions

Germany . 3,379 parts In-Stock

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$26.609

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$21.819

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IDEA Electronic Components Group

UK . 380 parts In-Stock

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$26.609

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$25.279

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$23.948

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380

$26.609

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$23.948

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One Stop Electronics

USA . 909 parts In-Stock

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$28.000

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909

$28.000

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Corphita

USA . 3,290 parts In-Stock

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Microchip USA

USA . 2,397 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S628-EGZ50-C2 by Texas Instruments, a top-of-the-line microcontroller designed to meet your diverse electronic needs. With Texas Instruments' reputation for quality and reliability backing it up, this microcontroller offers unparalleled performance and versatility in a compact package. Ideal for applications ranging from automotive to industrial automation, this product delivers exceptional value, benefits, and advantages to customers looking for cutting-edge technology. Elevate your projects to new heights with the LM3S628-EGZ50-C2 and experience the difference that Texas Instruments can make in your designs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility in power source selection.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easy alignment during assembly.

Bit Size: 32

32-bit architecture enables high-performance computing and processing capabilities.

Power Supplies (V): 3.3

Stable power supply of 3.3V ensures reliable operation of the microcontroller.

No. of Terminals: 48

Sufficient number of terminals for connecting various peripherals and components to the microcontroller.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good protection for the microcontroller chip and facilitates easy replacement if needed.

Minimum Supply Voltage: 3 V

Can operate at low voltage levels, making it suitable for battery-powered applications.

Maximum Operating Temperature: 105 °C

Wide operating temperature range allows the microcontroller to function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for outdoor or industrial applications.

ADC Channels: YES

Integrated analog-to-digital converter channels for reading and processing analog sensor data.

Terminal Position: QUAD

Quad terminal position provides easy access for connecting external components and peripherals.

ROM Words: 32768

Large ROM size of 32768 words for storing program instructions and data.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1 mm for compact and space-efficient designs.

Width: 6.875 mm

Narrow width of 6.875 mm for fitting into tight spaces on PCBs.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz for fast and efficient operation.

Length: 6.875 mm

Compact length of 6.875 mm for space-saving board layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range, ensuring reliable performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture with integrated peripherals for efficient and streamlined processing.

RAM Bytes: 8192

Ample RAM size of 8192 bytes for temporary data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS-compliant designs.

Maximum Supply Current: 110 mA

Low maximum supply current of 110 mA for efficient power usage.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V for consistent performance.

PWM Channels: YES

Integrated PWM channels for precise control of motor speeds and power levels.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm for high-density PCB designs.

Speed: 50 rpm

Operates at a speed of 50 rpm, suitable for various real-time control applications.

No. of I/O Lines: 28

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S628-EGZ50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S628-EGZ50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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