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LM3S618-EQN50-C2

Texas Instruments

LM3S618-EQN50-C2 by Texas Instruments

LM3S618-EQN50-C2 by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at a max frequency of 0.032 MHz. Ideal for industrial applications, it features 8192 bytes of RAM, FLASH ROM programmability, and PWM channels for efficient control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,862 parts In-Stock

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Digiode

USA . 2,180 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 762 parts In-Stock

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$16.477

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762

$16.477

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One Stop Electronics

USA . 1,218 parts In-Stock

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$23.000

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Parana Technologies

USA . 1,640 parts In-Stock

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$25.279

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$25.908

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$25.279

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DigiPath Technology Company

USA . 774 parts In-Stock

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$27.835

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774

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ChromeModa Solutions

Germany . 6,664 parts In-Stock

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$28.403

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$23.290

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$28.403

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IDEA Electronic Components Group

UK . 2,044 parts In-Stock

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$28.403

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$26.983

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$25.563

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2,044

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Microchip USA

USA . 2,171 parts In-Stock

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$31.730

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$31.540

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$31.440

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$31.340

2,171

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$31.340

Component Stockers USA

USA . 228 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 14,826 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 4,170 parts In-Stock

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Overview

Discover the LM3S618-EQN50-C2 by Texas Instruments, a top-of-the-line microcontroller that sets the standard for quality and reliability in the industry. With its innovative technology and versatile applications, this product offers unmatched value and benefits to customers looking for high-performance solutions. Whether you're working on IoT projects, embedded systems, or robotics, this microcontroller delivers superior performance and efficiency, making it the perfect choice for your next project. Trust Texas Instruments to provide you with the best tools for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making this microcontroller suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V enables compatibility with a variety of power sources without risking damage to the microcontroller.

Package Shape: SQUARE

Square package shape offers uniformity in footprint, simplifying PCB layout and design.

Bit Size: 32

32-bit architecture provides enhanced processing power and efficiency, suitable for handling complex tasks and computations.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance and operation of the microcontroller.

No. of Terminals: 48

48 terminals provide ample connectivity options for interfacing with external devices and peripherals.

Maximum Operating Temperature: 105 °C

High operational temperature range of up to 105°C allows for use in demanding environments and industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish offers good electrical conductivity and corrosion resistance, ensuring reliable signal transmission.

ADC Channels: YES

Built-in ADC channels enable analog signal conversion, expanding the range of sensors and devices that can be interfaced with the microcontroller.

ROM Words: 32768

Large ROM capacity of 32768 words allows for storing program instructions and data, making it suitable for complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller design offers efficient instruction execution and high performance, suitable for a wide range of applications.

RAM Bytes: 8192

Ample RAM capacity of 8192 bytes enables efficient data processing and storage while executing multiple tasks simultaneously.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, making this microcontroller energy-efficient and versatile.

Technical Specifications

Microcontrollers LM3S618-EQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S618-EQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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