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LM3S612-IQN50-C2

Texas Instruments

LM3S612-IQN50-C2 by Texas Instruments

Texas Instruments LM3S612-IQN50-C2 microcontroller features 32-bit Cortex-M3 CPU, 8KB RAM, and 32768 ROM words. Ideal for industrial applications, it offers 110mA max supply current, operates b/w -40 to 85°C, and supports peripherals like PWM and timers.

Median Price

$5.855

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 118 parts In-Stock

1+ parts

-

100+ parts

$6.280

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118

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$6.280

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Rochester

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$5.430

1k+ parts

$4.860

10k+ parts

$4.580

30

-

$5.430

$4.860

$4.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,205 parts In-Stock

1+ parts

$5.738

100+ parts

-

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4,205

$5.738

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Vyrian

USA . 6,492 parts In-Stock

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6,492

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DigiKey Marketplace

USA . 30 parts In-Stock

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,372 parts In-Stock

1+ parts

$5.436

100+ parts

-

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4,372

$5.436

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Parana Technologies

USA . 2,331 parts In-Stock

1+ parts

$50.673

100+ parts

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2,331

$50.673

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DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

$55.797

100+ parts

-

1k+ parts

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10k+ parts

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1,334

$55.797

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ChromeModa Solutions

Germany . 2,680 parts In-Stock

1+ parts

$56.936

100+ parts

$46.688

1k+ parts

-

10k+ parts

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2,680

$56.936

$46.688

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IDEA Electronic Components Group

UK . 826 parts In-Stock

1+ parts

$56.936

100+ parts

$54.089

1k+ parts

$51.242

10k+ parts

-

826

$56.936

$54.089

$51.242

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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Microchip USA

USA . 210 parts In-Stock

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Overview

Enhance your projects with the LM3S612-IQN50-C2 microcontroller by Texas Instruments, a powerhouse in the world of electronics. With cutting-edge technology and reliable performance, this microcontroller offers seamless integration and versatility for a wide range of applications. From industrial automation to embedded systems, this product delivers exceptional value and efficiency. Trust Texas Instruments to provide top-tier quality and innovation, setting new standards in the industry. Elevate your designs with the LM3S612-IQN50-C2 and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Integrated Cache: YES

Having integrated cache enhances the efficiency and speed of the microcontroller, resulting in better performance.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into electronic devices, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options, catering to different system requirements.

On Chip Data RAM Width: 8

A wider data RAM width enables faster data processing and storage capability, improving overall system performance.

Package Shape: SQUARE

The square package shape ensures uniform distribution of components on the PCB, optimizing space utilization and signal integrity.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data sets and perform more complex calculations efficiently.

No. of I/O Lines: 34

Having 34 I/O lines provides ample connectivity options for interfacing with other devices, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S612-IQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

34

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

PWM(2), TIMER(3), WDT

Analog To Digital Convertors:

2-Ch 10-Bit

Trade Compliance

LM3S612-IQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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