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LM3S612-IGZ50-C2T

Texas Instruments

LM3S612-IGZ50-C2T by Texas Instruments

LM3S612-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 32768 ROM words, and 8192 RAM bytes. It operates in industrial temperatures from -40 to 85°C and features Cortex-M3 CPU family for various applications like PWM control and ADC sensing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,083 parts In-Stock

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4,083

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Vyrian

USA . 1,994 parts In-Stock

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1,994

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Distributors (Availability)

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AZTECH Wire

Italy . 298 parts In-Stock

1+ parts

$7.764

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298

$7.764

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One Stop Electronics

USA . 789 parts In-Stock

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$28.000

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789

$28.000

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Parana Technologies

USA . 143 parts In-Stock

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$76.398

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143

$76.398

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DigiPath Technology Company

USA . 2,367 parts In-Stock

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$84.123

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$77.393

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2,367

$84.123

$77.393

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ChromeModa Solutions

Germany . 6,262 parts In-Stock

1+ parts

$85.840

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$70.389

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6,262

$85.840

$70.389

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IDEA Electronic Components Group

UK . 1,654 parts In-Stock

1+ parts

$85.840

100+ parts

$81.548

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$77.256

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1,654

$85.840

$81.548

$77.256

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Microchip USA

USA . 4,556 parts In-Stock

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Corphita

USA . 3,486 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S612-IGZ50-C2T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that are perfect for a wide range of applications. With advanced technology and reliable performance, this microcontroller offers customers unmatched value and benefits. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, the LM3S612-IGZ50-C2T provides the perfect solution for all your needs. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the microcontroller lightweight and durable, ensuring reliable performance in various applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Operates efficiently within a range of up to 3.6 V, providing flexibility in power supply options while maintaining stable performance.

Package Shape: SQUARE

The square shape of the package makes it easy to handle and place in circuit designs, optimizing space utilization on the board.

Bit Size: 32

The 32-bit architecture allows for high-speed processing and computation, making it suitable for advanced applications that require complex algorithms.

Power Supplies (V): 3.3

Operates at a nominal supply voltage of 3.3 V, ensuring compatibility with standard power sources and reducing the need for additional voltage regulation.

No. of Terminals: 48

With 48 terminals, the microcontroller offers ample connectivity options for interfacing with external components and peripherals, enhancing flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and robust housing for the microcontroller, facilitating easy handling and integration onto PCBs.

Minimum Supply Voltage: 3 V

Can operate at a minimum supply voltage of 3 V, ensuring reliable performance even under lower power conditions.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85°C, making it suitable for industrial applications that require extended temperature ranges.

CPU Family: CORTEX-M3

Based on the Cortex-M3 architecture, this microcontroller offers high performance and energy efficiency for a wide range of applications.

Minimum Operating Temperature: -40 °C

Capable of operating at temperatures as low as -40°C, making it suitable for harsh environments and outdoor applications.

ADC Channels: YES

Features analog-to-digital converter channels, allowing for the conversion of external analog signals into digital data for processing and analysis.

Terminal Position: QUAD

The quad terminal position offers a convenient layout for connecting external components and peripherals, simplifying the circuit design process.

ROM Words: 32768

With 32K ROM words, the microcontroller has ample storage capacity for program memory, enabling the implementation of complex algorithms and functions.

Maximum Seated Height: 1 mm

The low seated height of 1 mm allows for slim and compact designs, ideal for applications where space constraints are a concern.

Width: 6.875 mm

The narrow width of 6.875 mm enables space-efficient placement on PCBs, optimizing board layout and allowing for dense circuit designs.

Maximum Clock Frequency: 0.032 MHz

Capable of operating at a maximum clock frequency of 0.032 MHz, delivering high-speed processing for time-critical applications.

Length: 6.875 mm

The compact length of 6.875 mm contributes to the overall small footprint of the microcontroller, allowing for efficient use of board space.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature range, ensuring reliable operation in harsh environmental conditions and challenging applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture of the microcontroller facilitates efficient instruction execution and low power consumption, making it suitable for battery-powered devices.

RAM Bytes: 8192

With 8K RAM bytes, the microcontroller provides sufficient memory for data storage and manipulation, enabling efficient multitasking and data processing.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ensuring efficient operation and robust performance in various environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the mounting and soldering process, enhancing the reliability and durability of the connections.

Maximum Supply Current: 110 mA

Operates at a maximum supply current of 110 mA, ensuring efficient power usage and minimizing energy consumption for optimal performance.

Nominal Supply Voltage: 3.3 V

Maintains a nominal supply voltage of 3.3 V, providing stable and reliable power delivery for consistent performance in varied operating conditions.

PWM Channels: YES

Supports pulse-width modulation (PWM) channels, allowing for precise control of analog signals and motor speed, essential for a wide range of applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and flexible programming of the microcontroller, facilitating rapid prototyping and firmware updates.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables fine-pitch interconnection with other components on the PCB, enhancing connectivity and reducing signal interference.

Speed: 50 rpm

With a speed of 50 rpm, the microcontroller offers rapid processing and response times, ensuring real-time performance for time-sensitive applications.

No. of I/O Lines: 34

Provides 34 I/O lines for versatile input and output configurations, enabling seamless interfacing with a wide range of external devices and sensors.

Technical Specifications

Microcontrollers LM3S612-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

Length:

6.875 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S612-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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