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LM3S6110-IQC25-A2

Texas Instruments

LM3S6110-IQC25-A2 by Texas Instruments

Texas Instruments LM3S6110-IQC25-A2 is a 32-bit microcontroller with Cortex-M3 CPU family. It operates b/w -40 to 85 °C, has 16384 RAM Bytes, and 65536 ROM Words. Suitable for industrial applications, it offers PWM and ADC channels, with a clock frequency of 0.032 MHz.

Median Price

$16.587

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 993 parts In-Stock

1+ parts

-

100+ parts

$13.270

1k+ parts

$11.870

10k+ parts

$11.180

993

-

$13.270

$11.870

$11.180

DigiKey

USA . 993 parts In-Stock

1+ parts

-

100+ parts

$17.460

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993

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$17.460

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Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$16.587

1k+ parts

$14.838

10k+ parts

$13.975

900

-

$16.587

$14.838

$13.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,410 parts In-Stock

1+ parts

$14.012

100+ parts

-

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2,410

$14.012

-

-

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Vyrian

USA . 4,102 parts In-Stock

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4,102

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DigiKey Marketplace

USA . 109 parts In-Stock

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109

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,456 parts In-Stock

1+ parts

$13.275

100+ parts

-

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4,456

$13.275

-

-

-

Parana Technologies

USA . 444 parts In-Stock

1+ parts

$15.186

100+ parts

-

1k+ parts

$15.585

10k+ parts

-

444

$15.186

-

$15.585

-

ChromeModa Solutions

Germany . 3,621 parts In-Stock

1+ parts

$17.063

100+ parts

$13.992

1k+ parts

-

10k+ parts

-

3,621

$17.063

$13.992

-

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IDEA Electronic Components Group

UK . 962 parts In-Stock

1+ parts

$17.063

100+ parts

$16.210

1k+ parts

$15.357

10k+ parts

-

962

$17.063

$16.210

$15.357

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DigiPath Technology Company

USA . 1,487 parts In-Stock

1+ parts

-

100+ parts

$15.384

1k+ parts

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1,487

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$15.384

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Microchip USA

USA . 263 parts In-Stock

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263

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A-Z Elektronik GmbH

Germany . 107 parts In-Stock

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Kepictronics

USA . 71 parts In-Stock

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Futuretech Components

Singapore . 70 parts In-Stock

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70

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Overview

Experience unparalleled performance and reliability with the LM3S6110-IQC25-A2 Microcontroller from Texas Instruments, a leading manufacturer in the industry. Designed for a wide range of applications, this powerful 32-bit device offers exceptional value and benefits to customers seeking cutting-edge technology. With its advanced features and industrial-grade components, this microcontroller delivers seamless operation, making it the ideal choice for your next project. Unlock endless possibilities and elevate your designs with the quality and expertise of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 2.75 V

A lower maximum supply voltage helps in reducing power consumption and is suitable for low-power applications.

Bit Size: 32

The 32-bit architecture provides high processing power and performance for complex applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages offers flexibility in system design and compatibility with different peripherals.

Package Style (Meter): FLATPACK

The flatpack design allows for easy integration into compact electronic devices and reduces overall system size.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its energy efficiency and high performance, making it ideal for embedded applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliability in extreme temperature environments.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

ROM Words: 65536

Large ROM capacity provides ample storage for firmware and program code.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing speed and efficiency, making the microcontroller suitable for real-time applications.

RAM Bytes: 16384

Sufficient RAM capacity allows for smooth multitasking and data processing in the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall system performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the level of protection against moisture, ensuring reliability in humid environments.

No. of I/O Lines: 35

A high number of I/O lines enable versatile interfacing with external devices and peripherals, expanding the microcontroller's capabilities.

Technical Specifications

Microcontrollers LM3S6110-IQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

35

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6110-IQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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