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LM3S6110-EQC25-A2T

Texas Instruments

LM3S6110-EQC25-A2T by Texas Instruments

Texas Instruments LM3S6110-EQC25-A2T is a 32-bit microcontroller with 100 terminals, operating at up to 0.032 MHz clock frequency. Ideal for industrial applications, it features FLASH ROM programmability, 35 I/O lines, and PWM channels for precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,821 parts In-Stock

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8,821

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Digiode

USA . 232 parts In-Stock

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232

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Distributors (Availability)

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$13.486

100+ parts

-

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281

$13.486

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One Stop Electronics

USA . 363 parts In-Stock

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$14.000

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363

$14.000

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Parana Technologies

USA . 2,065 parts In-Stock

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$64.534

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2,065

$64.534

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DigiPath Technology Company

USA . 1,241 parts In-Stock

1+ parts

$71.060

100+ parts

$65.375

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1,241

$71.060

$65.375

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ChromeModa Solutions

Germany . 6,242 parts In-Stock

1+ parts

$72.510

100+ parts

$59.458

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6,242

$72.510

$59.458

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IDEA Electronic Components Group

UK . 83 parts In-Stock

1+ parts

$72.510

100+ parts

$68.884

1k+ parts

$65.259

10k+ parts

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83

$72.510

$68.884

$65.259

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Corphita

USA . 2,713 parts In-Stock

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2,713

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Microchip USA

USA . 388 parts In-Stock

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388

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Overview

Unlock the power of innovation with the LM3S6110-EQC25-A2T microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This microcontroller is ideal for a wide range of applications, offering customers unparalleled value and benefits. Whether you're designing IoT devices, robotics, or industrial automation systems, the LM3S6110-EQC25-A2T provides the performance and efficiency you need to stay ahead of the curve. Elevate your projects with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protects the internal components from external elements.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and enabling high-density designs.

Maximum Supply Voltage: 2.75 V

Allows for safe operation within a specified voltage range, preventing damage to the microcontroller.

Package Shape: SQUARE

Enables easy integration into square form factor designs, optimizing space utilization.

Bit Size: 32

Provides a high level of processing power, suitable for a wide range of applications.

No. of Terminals: 100

Offers ample connectivity options for interfacing with other components in a system.

Package Style (Meter): FLATPACK

Facilitates efficient heat dissipation and enhances the overall reliability of the microcontroller.

Minimum Supply Voltage: 2.25 V

Ensures stable operation even under low voltage conditions, improving the reliability of the system.

Maximum Operating Temperature: 105 °C

Allows for reliable performance in high-temperature environments, making it suitable for industrial applications.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance, ensuring robust electrical connections.

ADC Channels: YES

Enables analog-to-digital conversion, essential for interfacing with analog sensors and peripherals.

Terminal Position: QUAD

Facilitates easy connection to external components and simplifies PCB layout.

Maximum Seated Height: 1.6 mm

Ensures a low-profile design, ideal for space-constrained applications.

Width: 14 mm

Compact size allows for flexible integration into various electronic devices.

Maximum Clock Frequency: 0.032 MHz

Provides high-speed processing capabilities, suitable for real-time applications.

Length: 14 mm

Compact dimensions make it suitable for small form factor products and portable devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in tough conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing, enabling quick response times in embedded applications.

Technology: CMOS

Low power consumption and high noise immunity characteristics, suitable for battery-powered devices.

Terminal Form: GULL WING

Facilitates easy soldering and rework, enhancing manufacturing flexibility.

Nominal Supply Voltage: 2.5 V

Standard voltage level for stable operation, ensuring compatibility with common power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of motor speeds and LED brightness.

ROM Programmability: FLASH

Allows for flexible programming and firmware updates, enhancing the versatility of the microcontroller.

Terminal Pitch: 0.5 mm

Enables high-density mounting on PCBs, optimizing space utilization in compact designs.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during storage and handling, ensuring long-term reliability.

Speed: 25 rpm

Provides fast processing speeds, suitable for time-critical applications and high-performance tasks.

No. of I/O Lines: 35

Offers sufficient input/output options for connecting various external devices and sensors, enhancing system flexibility.

Technical Specifications

Microcontrollers LM3S6110-EQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

35

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6110-EQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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