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LM3S6110-EQC25-A2

Texas Instruments

LM3S6110-EQC25-A2 by Texas Instruments

Texas Instruments' LM3S6110-EQC25-A2 is a 32-bit microcontroller with 100 terminals, operating at up to 0.032 MHz. Ideal for industrial applications, it features ADC and PWM channels, FLASH ROM programmability, and operates in temperatures up to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,581 parts In-Stock

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Digiode

USA . 885 parts In-Stock

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885

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Distributors (Availability)

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AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$18.501

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737

$18.501

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One Stop Electronics

USA . 1,154 parts In-Stock

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$24.000

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$24.000

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Parana Technologies

USA . 2,275 parts In-Stock

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$41.999

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2,275

$41.999

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DigiPath Technology Company

USA . 505 parts In-Stock

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$46.246

100+ parts

$42.547

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505

$46.246

$42.547

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ChromeModa Solutions

Germany . 6,712 parts In-Stock

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$47.190

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$38.696

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6,712

$47.190

$38.696

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IDEA Electronic Components Group

UK . 2,366 parts In-Stock

1+ parts

$47.190

100+ parts

$44.830

1k+ parts

$42.471

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2,366

$47.190

$44.830

$42.471

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Corphita

USA . 1,910 parts In-Stock

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Microchip USA

USA . 121 parts In-Stock

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Overview

Discover the LM3S6110-EQC25-A2 by Texas Instruments, a top-of-the-line microcontroller that offers unmatched quality and reliability. Manufactured by a trusted industry leader, this product is perfect for a wide range of applications. With advanced features and cutting-edge technology, this microcontroller delivers exceptional performance and flexibility. Whether you're designing a new project or upgrading an existing one, the LM3S6110-EQC25-A2 provides incredible value, benefits, and advantages that will exceed your expectations. Unlock endless possibilities with this high-quality microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, perfect for compact electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 2.75 V

A higher maximum supply voltage provides flexibility in power supply options while ensuring safe operation within specified limits.

Package Shape: SQUARE

Square packages typically offer good thermal conductivity and easier PCB layout compared to other shapes.

Bit Size: 32

A 32-bit microcontroller provides high processing power and allows for complex applications to be handled efficiently.

No. of Terminals: 100

Having 100 terminals allows for multiple connections, enabling the microcontroller to interface with various external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack packages offer a low profile and efficient use of board space, making them suitable for compact devices.

Minimum Supply Voltage: 2.25 V

A low minimum supply voltage enables the microcontroller to operate in a wider range of power supply conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and extended use.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

ADC Channels: YES

Analog-to-digital converter (ADC) channels allow the microcontroller to convert analog signals into digital data, essential for sensor interfacing and data acquisition.

Terminal Position: QUAD

Quad terminal position offers a balanced layout for efficient routing of connections and signals on the PCB.

Maximum Seated Height: 1.6 mm

A low seated height saves vertical space on the PCB, enabling compact designs for portable and space-constrained applications.

Width: 14 mm

A moderate width provides a good balance between board space utilization and terminal accessibility for connection purposes.

Maximum Clock Frequency: 0.032 MHz

A high clock frequency enables fast data processing and real-time operation, crucial for time-sensitive applications.

Length: 14 mm

A moderate length allows for the microcontroller to fit comfortably on the PCB without occupying excessive space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in extended temperature ranges, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller offers high performance, reduced power consumption, and efficient code execution for optimized system operation.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital interfaces, making the microcontroller energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminals ensure secure mechanical attachment and easy soldering during assembly, enhancing the overall reliability of the microcontroller.

Nominal Supply Voltage: 2.5 V

A stable nominal supply voltage ensures consistent and reliable operation of the microcontroller under normal operating conditions.

PWM Channels: YES

Pulse-width modulation (PWM) channels allow for precise control of output signals, making the microcontroller suitable for applications requiring accurate analog control.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications to the microcontroller's firmware, improving flexibility and adaptability for future enhancements.

Terminal Pitch: 0.5 mm

A small terminal pitch facilitates high-density mounting on the PCB, enabling efficient use of board space and supporting miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage to prevent reliability issues in humid environments.

Speed: 25 rpm

Operating at 25 rotations per minute, this microcontroller provides sufficient processing speed for a wide range of applications, from basic control tasks to complex computations.

No. of I/O Lines: 35

With 35 I/O lines, the microcontroller can interface with numerous external devices and peripherals, enabling versatile connectivity options and diverse functionality.

Technical Specifications

Microcontrollers LM3S6110-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

35

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6110-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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