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LM3S611-IQN50-C2

Texas Instruments

LM3S611-IQN50-C2 by Texas Instruments

LM3S611-IQN50-C2 by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU family, 8KB RAM, and 4-Ch 10-Bit ADC channels. It operates at a max clock frequency of 0.032 MHz and features PWM(6), TIMER(3), WDT peripherals. Ideal for industrial applications requiring low power mode and connectivity via I2C, SSI, UART(2).

Median Price

$10.438

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 501 parts In-Stock

1+ parts

-

100+ parts

$8.350

1k+ parts

$7.470

10k+ parts

$7.030

501

-

$8.350

$7.470

$7.030

DigiKey

USA . 501 parts In-Stock

1+ parts

-

100+ parts

$10.990

1k+ parts

-

10k+ parts

-

501

-

$10.990

-

-

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$10.438

1k+ parts

$9.338

10k+ parts

$8.787

250

-

$10.438

$9.338

$8.787

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,936 parts In-Stock

1+ parts

$7.657

100+ parts

-

1k+ parts

-

10k+ parts

-

2,936

$7.657

-

-

-

Vyrian

USA . 4,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,440

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,504 parts In-Stock

1+ parts

$7.254

100+ parts

-

1k+ parts

-

10k+ parts

-

2,504

$7.254

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$19.010

100+ parts

$18.820

1k+ parts

$18.059

10k+ parts

-

100

$19.010

$18.820

$18.059

-

Microchip USA

USA . 230 parts In-Stock

1+ parts

$23.460

100+ parts

$23.130

1k+ parts

$22.960

10k+ parts

$22.790

230

$23.460

$23.130

$22.960

$22.790

Parana Technologies

USA . 871 parts In-Stock

1+ parts

$65.246

100+ parts

-

1k+ parts

-

10k+ parts

-

871

$65.246

-

-

-

DigiPath Technology Company

USA . 547 parts In-Stock

1+ parts

$71.844

100+ parts

$66.096

1k+ parts

-

10k+ parts

-

547

$71.844

$66.096

-

-

ChromeModa Solutions

Germany . 3,014 parts In-Stock

1+ parts

$73.310

100+ parts

$60.114

1k+ parts

-

10k+ parts

-

3,014

$73.310

$60.114

-

-

IDEA Electronic Components Group

UK . 1,408 parts In-Stock

1+ parts

$73.310

100+ parts

$69.644

1k+ parts

$65.979

10k+ parts

-

1,408

$73.310

$69.644

$65.979

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 639 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

639

-

-

-

-

Overview

Experience the power and precision of Texas Instruments with the LM3S611-IQN50-C2 microcontroller. Designed for industrial-grade applications, this versatile device offers a wide range of functionalities including PWM, timers, and ADC channels. With its low power mode and integrated cache, this microcontroller delivers optimal performance while conserving energy. Whether you're working on robotics, automation, or IoT projects, the LM3S611-IQN50-C2 is your go-to solution for seamless connectivity, high-speed processing, and reliable operation. Trust Texas Instruments to bring innovation and quality to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable, ideal for portable and rugged applications.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance and efficiency of the microcontroller by reducing data access time.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V allows for flexibility in power supply options while maintaining stability.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller is suitable for use in a wide range of environments, including harsh industrial settings.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family ensures compatibility and support for a wide range of software and development tools, making it a versatile choice for developers.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels integrated into the microcontroller allows for analog signal processing, making it suitable for sensor interfacing and data acquisition applications.

ROM Words: 32768

With 32768 ROM words, this microcontroller offers ample space for storing program instructions, enabling complex and feature-rich applications to be developed.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller ensures efficient and optimized execution of instructions, leading to improved performance and power efficiency.

Technical Specifications

Microcontrollers LM3S611-IQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

4

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI, UART(2)

Peripherals:

PWM(6), TIMER(3), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S611-IQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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