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LM3S6100-IQC25-A2

Texas Instruments

LM3S6100-IQC25-A2 by Texas Instruments

Texas Instruments' LM3S6100-IQC25-A2 microcontroller features a 32-bit Cortex-M3 CPU, 16384 bytes of RAM, and 65536 ROM words. With Ethernet connectivity, 3 timers, and PWM channels, it's ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,398 parts In-Stock

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3,398

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Digiode

USA . 363 parts In-Stock

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363

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 764 parts In-Stock

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$6.423

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764

$6.423

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Parana Technologies

USA . 648 parts In-Stock

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$20.704

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$20.830

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648

$20.704

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IDEA Electronic Components Group

UK . 732 parts In-Stock

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$23.263

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$22.100

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$20.937

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732

$23.263

$22.100

$20.937

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ChromeModa Solutions

Germany . 361 parts In-Stock

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$23.263

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$19.076

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361

$23.263

$19.076

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One Stop Electronics

USA . 956 parts In-Stock

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$24.000

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$44.659

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$40.640

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$36.620

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100

$44.659

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$36.620

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Microchip USA

USA . 1,892 parts In-Stock

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$77.420

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$76.070

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$75.400

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$74.730

1,892

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$76.070

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$74.730

Corphita

USA . 3,540 parts In-Stock

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DigiPath Technology Company

USA . 685 parts In-Stock

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$20.974

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685

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Overview

Unlock the potential of your next project with the LM3S6100-IQC25-A2 microcontroller from Texas Instruments. Designed with cutting-edge technology and high-quality materials, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, including industrial automation, robotics, and IoT devices, this microcontroller provides customers with value, efficiency, and innovation. Experience the benefits of seamless connectivity, low power consumption, and advanced peripherals, all in a compact and easy-to-use package. Trust in Texas Instruments to deliver top-notch solutions for your engineering needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring reliability and ease of handling.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data.

Maximum Supply Voltage: 2.75 V

Allows for operation within a safe voltage range, reducing the risk of damage.

CPU Family: CORTEX-M3

Utilizes a highly efficient and powerful CPU architecture for optimal performance.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing and data acquisition.

ROM Words: 65536

Sufficient memory capacity for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient data processing and control operations.

Connectivity: ETHERNET, SSI, UART

Supports various communication protocols for seamless integration with external devices.

Speed: 25 rpm

Provides high processing speed for real-time applications and rapid data processing.

Low Power Mode: YES

Enables energy-efficient operation for extended battery life and reduced power consumption.

Technical Specifications

Microcontrollers LM3S6100-IQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, SSI, UART

Peripherals:

TIMER(3), WDT

Trade Compliance

LM3S6100-IQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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