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LM3S6100-IBZ25-A2

Texas Instruments

LM3S6100-IBZ25-A2 by Texas Instruments

Texas Instruments' LM3S6100-IBZ25-A2 microcontroller features a 32-bit Cortex-M3 CPU, 108 terminals, and 16384 RAM bytes. With a max clock frequency of 0.032 MHz, it is ideal for industrial applications requiring PWM channels and ADC functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,565 parts In-Stock

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4,565

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Vyrian

USA . 4,326 parts In-Stock

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4,326

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Distributors (Availability)

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AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$7.894

100+ parts

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347

$7.894

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One Stop Electronics

USA . 422 parts In-Stock

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$13.000

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422

$13.000

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Parana Technologies

USA . 692 parts In-Stock

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$58.492

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692

$58.492

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ChromeModa Solutions

Germany . 5,302 parts In-Stock

1+ parts

$65.721

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$53.891

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5,302

$65.721

$53.891

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IDEA Electronic Components Group

UK . 1,262 parts In-Stock

1+ parts

$65.721

100+ parts

$62.435

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$59.149

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1,262

$65.721

$62.435

$59.149

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Corphita

USA . 4,420 parts In-Stock

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4,420

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Microchip USA

USA . 469 parts In-Stock

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DigiPath Technology Company

USA . 175 parts In-Stock

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$59.254

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175

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$59.254

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Overview

Unlock endless possibilities with the LM3S6100-IBZ25-A2 microcontroller by Texas Instruments. Designed with cutting-edge technology and built to last, this device offers unparalleled performance in a compact package. Perfect for a wide range of applications, from industrial automation to consumer electronics, this microcontroller provides reliable and efficient operation. Experience the value of Texas Instruments' expertise and innovation with the LM3S6100-IBZ25-A2, where quality meets functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and prevents damage to the microcontroller.

Package Shape: SQUARE

The square package shape helps in efficient placement on the PCB and saves space in the design.

Bit Size: 32

The 32-bit architecture provides increased processing power and performance for complex applications.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options allows flexibility in design and compatibility with various systems.

No. of Terminals: 108

The high number of terminals enables connectivity with a wide range of external components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced thermal performance and reliability for the microcontroller.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the microcontroller to be used in harsh industrial environments.

CPU Family: CORTEX-M3

The Cortex-M3 architecture provides high efficiency and performance, making this microcontroller suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and resistance to corrosion, ensuring long-term reliability of the connections.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its application capabilities.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and ensures easy access to the terminals during assembly and maintenance.

ROM Words: 65536

The large ROM capacity of 65536 words allows for storing program code and data, enabling the microcontroller to handle complex tasks.

Maximum Seated Height: 1.5 mm

The low maximum seated height of 1.5mm saves space in the overall design and allows for compact and slim device profiles.

Width: 10 mm

The compact width of 10mm enables the microcontroller to be integrated into small form factor devices and applications.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 32MHz allows for fast and efficient processing of instructions, resulting in responsive performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30s ensures reliable soldering during production without compromising component integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for lead-free soldering processes, conforming to modern environmental standards.

Length: 10 mm

The compact length of 10mm further contributes to space-saving design and integration in compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments and industrial applications with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers high performance and efficiency, making it suitable for real-time and processing-intensive applications.

RAM Bytes: 16384

The ample RAM capacity of 16384 bytes allows for efficient data processing and manipulation, supporting multitasking and data-intensive operations.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption, high speed, and reliability, making it suitable for battery-powered and portable devices.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable solder joints, ensuring long-term performance and durability of the microcontroller.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures stable and consistent operation of the microcontroller, minimizing the risk of voltage fluctuations.

PWM Channels: YES

The PWM channels allow for precise control of analog signals, enabling the microcontroller to drive motors, LEDs, and other peripherals with varying levels of power.

ROM Programmability: FLASH

The ROM programmability using flash memory technology allows for easy and quick updating of firmware and program code, enhancing flexibility and maintainability.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8mm enables high-density mounting of the microcontroller, maximizing PCB space utilization and component integration.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates the microcontroller's sensitivity to moisture during storage and handling, requiring appropriate precautions to prevent damage.

Speed: 25 rpm

The speed of 25rpm indicates the maximum processing speed of the microcontroller, ensuring efficient execution of instructions and tasks in real-time applications.

No. of I/O Lines: 30

The high number of I/O lines allows for flexible interfacing with external devices and peripherals, enabling diverse connectivity options and functionality.

Technical Specifications

Microcontrollers LM3S6100-IBZ25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S6100-IBZ25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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