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LM3S6100-EQC25-A2T

Texas Instruments

LM3S6100-EQC25-A2T by Texas Instruments

LM3S6100-EQC25-A2T by Texas Instruments is a 32-bit microcontroller with 100 terminals, operating at speeds up to 32 MHz. It features 16KB RAM, 65,536 ROM words, and ADC channels for industrial applications requiring a temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,435 parts In-Stock

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4,435

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Digiode

USA . 2,260 parts In-Stock

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2,260

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Distributors (Availability)

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One Stop Electronics

USA . 915 parts In-Stock

1+ parts

$3.000

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915

$3.000

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Parana Technologies

USA . 1,193 parts In-Stock

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$15.931

100+ parts

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$16.286

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$15.931

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$16.286

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DigiPath Technology Company

USA . 2,280 parts In-Stock

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$17.542

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2,280

$17.542

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ChromeModa Solutions

Germany . 4,573 parts In-Stock

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$17.900

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$14.678

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4,573

$17.900

$14.678

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IDEA Electronic Components Group

UK . 2,322 parts In-Stock

1+ parts

$17.900

100+ parts

$17.005

1k+ parts

$16.110

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2,322

$17.900

$17.005

$16.110

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AZTECH Wire

Italy . 425 parts In-Stock

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$19.689

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425

$19.689

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Corphita

USA . 374 parts In-Stock

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374

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Microchip USA

USA . 343 parts In-Stock

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Overview

Discover the LM3S6100-EQC25-A2T by Texas Instruments, a high-quality microcontroller designed to elevate your projects to new heights. With cutting-edge technology and a reputation for excellence, Texas Instruments delivers unmatched performance and reliability. From industrial applications to consumer electronics, this versatile microcontroller offers endless possibilities. Unlock the potential of your creations with the LM3S6100-EQC25-A2T and experience the value, benefits, and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and can withstand various environmental conditions.

Surface Mount: YES

Easy to mount on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 2.75 V

Efficient power consumption and suitable for low voltage applications.

Package Shape: SQUARE

Space-saving design and easy to work with for PCB layout.

Bit Size: 32

High processing capability and precision for complex operations.

Power Supplies (V): 2.5,3.3

Versatile voltage options for compatibility with different power sources.

No. of Terminals: 100

Sufficient connectivity options for interfacing with external components.

Package Style (Meter): FLATPACK

Compact form factor for space-constrained applications.

Minimum Supply Voltage: 2.25 V

Wide operating voltage range for flexibility in power supply selection.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature conditions.

CPU Family: CORTEX-M3

High-performance ARM-based microcontroller architecture for efficient processing.

Minimum Operating Temperature: -40 °C

Operational in extreme cold environments without performance degradation.

ADC Channels: YES

Analog-to-Digital conversion capability for sensor interfacing and data acquisition.

Terminal Position: QUAD

Organized terminal layout for easy connectivity and maintenance.

ROM Words: 65536

Sufficient memory space for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 14 mm

Compact dimensions for fitting into small electronic devices.

Maximum Clock Frequency: 0.032 MHz

High-speed operation for real-time processing requirements.

Length: 14 mm

Square form factor for uniform layout and design aesthetics.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments with temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient Reduced Instruction Set Computing architecture for optimized performance.

RAM Bytes: 16384

Adequate random access memory for storing temporary data during operation.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Secure terminal design for robust soldering and connection stability.

Nominal Supply Voltage: 2.5 V

Stable voltage supply for consistent performance and longevity.

PWM Channels: YES

Pulse Width Modulation support for precise control of analog output signals.

ROM Programmability: FLASH

Flash memory technology for reprogrammable and reliable storage of firmware.

Terminal Pitch: 0.5 mm

Fine pitch spacing for high-density mounting on PCBs with multiple connections.

Speed: 25 rpm

Operating speed of 25 rotations per minute for efficient data processing.

No. of I/O Lines: 30

Sufficient input/output lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S6100-EQC25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

30

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S6100-EQC25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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