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LM3S610-EGZ50-C2T

Texas Instruments

LM3S610-EGZ50-C2T by Texas Instruments

LM3S610-EGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at up to 0.032 MHz. It features 8192 bytes of RAM, 32768 ROM words, and ADC channels for industrial applications requiring a CPU family of CORTEX-M3.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,990 parts In-Stock

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3,990

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Vyrian

USA . 3,977 parts In-Stock

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3,977

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Distributors (Availability)

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AZTECH Wire

Italy . 882 parts In-Stock

1+ parts

$6.538

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882

$6.538

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One Stop Electronics

USA . 799 parts In-Stock

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$20.000

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799

$20.000

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Parana Technologies

USA . 1,276 parts In-Stock

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$31.510

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$81.644

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1,276

$31.510

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DigiPath Technology Company

USA . 305 parts In-Stock

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$34.697

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$31.921

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305

$34.697

$31.921

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ChromeModa Solutions

Germany . 1,473 parts In-Stock

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$35.405

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$29.032

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$35.405

$29.032

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IDEA Electronic Components Group

UK . 378 parts In-Stock

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$35.405

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$33.635

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$31.864

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378

$35.405

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$31.864

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Corphita

USA . 4,605 parts In-Stock

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Microchip USA

USA . 2,699 parts In-Stock

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Overview

Texas Instruments, a renowned manufacturer in the electronics industry, presents the LM3S610-EGZ50-C2T microcontroller. Ideal for various applications, this powerful 32-bit microcontroller offers customers unmatched quality and reliability. With features like high clock frequency, flash ROM programmability, and numerous I/O lines, this chip carrier package delivers exceptional performance. Experience seamless operation and efficiency with the LM3S610-EGZ50-C2T, setting new standards in the world of microcontrollers. Upgrade your projects today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

Can support a wide range of applications without the risk of damaging the microcontroller due to high voltage.

Package Shape: SQUARE

Square package shape helps in optimal space utilization on the PCB, especially important for compact designs.

Bit Size: 32

32-bit architecture provides higher processing power and performance compared to lower bit-sized microcontrollers.

Power Supplies (V): 3.3

Operates efficiently at a common voltage level of 3.3V, ensuring compatibility with various components.

No. of Terminals: 48

Sufficient number of terminals for connecting to peripherals and other components, offering flexibility in design.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides mechanical protection and heat dissipation, enhancing the durability and reliability of the microcontroller.

Minimum Supply Voltage: 3 V

Supports low voltage operation, conserving power and extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

Capable of withstanding high operating temperatures, suitable for industrial environments where temperature fluctuations can occur.

CPU Family: CORTEX-M3

Part of the Cortex-M3 family known for high performance and low power consumption, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it suitable for a wide range of environments.

ADC Channels: YES

Integrated ADC channels allow for analog inputs, enabling the microcontroller to interface with sensors and other analog devices.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connectivity, reducing the chances of signal interference or loss.

ROM Words: 32768

Ample ROM memory for storing program instructions and data, enabling complex applications to be executed efficiently.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1mm allows for compact and slim product designs.

Width: 6.875 mm

Narrow width makes it suitable for applications where space is limited, optimizing board layout and design.

Maximum Clock Frequency: 0.032 MHz

High clock frequency of 0.032 MHz allows for fast data processing and execution of instructions, improving overall system performance.

Length: 6.875 mm

Compact length size enables the microcontroller to be easily integrated into small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and low power consumption, making it suitable for embedded applications.

RAM Bytes: 8192

Sufficient RAM memory for data storage and manipulation, supporting multitasking and real-time processing requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, essential for reliable operation in varied environments.

Terminal Form: NO LEAD

No-lead terminal form simplifies the assembly process and enhances thermal performance, improving overall product reliability.

Maximum Supply Current: 110 mA

Low supply current requirement of 110 mA helps in conserving power and extending battery life in battery-operated devices.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage of 3.3V ensures consistent performance and compatibility with various components.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels allows for precise control of analog signals, useful in motor control and other applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to firmware, essential for maintaining and improving the product's functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting, saving PCB space and allowing for more compact designs.

Speed: 50 rpm

Operates at a speed of 50 rotations per minute, suitable for applications requiring precise timing control or motor speed regulation.

No. of I/O Lines: 34

Sufficient number of Input/Output lines for interfacing with external devices, sensors, and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S610-EGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S610-EGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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