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LM3S608-IGZ50-C2T

Texas Instruments

LM3S608-IGZ50-C2T by Texas Instruments

LM3S608-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 48 terminals, and 32768 ROM words. It is ideal for industrial applications requiring a max clock frequency of 0.032 MHz, featuring ADC channels, PWM channels, and 28 I/O lines for versatile connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,515 parts In-Stock

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Digiode

USA . 2,820 parts In-Stock

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2,820

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Distributors (Availability)

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One Stop Electronics

USA . 482 parts In-Stock

1+ parts

$3.000

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482

$3.000

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AZTECH Wire

Italy . 309 parts In-Stock

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$8.035

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309

$8.035

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Parana Technologies

USA . 1,621 parts In-Stock

1+ parts

$59.462

100+ parts

$5,521.929

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$53.516

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1,621

$59.462

$5,521.929

$53.516

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DigiPath Technology Company

USA . 1,265 parts In-Stock

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$65.475

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1,265

$65.475

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ChromeModa Solutions

Germany . 4,732 parts In-Stock

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$66.811

100+ parts

$54.785

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4,732

$66.811

$54.785

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IDEA Electronic Components Group

UK . 1,697 parts In-Stock

1+ parts

$66.811

100+ parts

$63.470

1k+ parts

$60.130

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1,697

$66.811

$63.470

$60.130

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Microchip USA

USA . 2,457 parts In-Stock

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Corphita

USA . 1,426 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the LM3S608-IGZ50-C2T microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products designed to meet the demands of various applications. The LM3S608-IGZ50-C2T is perfect for projects requiring high-performance and reliability. With its advanced features and versatile capabilities, this microcontroller offers unmatched value and benefits to customers looking to elevate their designs to the next level. Experience seamless integration and exceptional performance with the LM3S608-IGZ50-C2T from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller convenient for mass production.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options, ensuring compatibility with a wide range of systems.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, making it ideal for compact designs.

Bit Size: 32

32-bit architecture ensures high processing power and efficiency, suitable for demanding applications.

Power Supplies (V): 3.3

Operates at a standard voltage, making it easy to integrate into existing systems.

No. of Terminals: 48

A high number of terminals provide ample I/O options for connecting to various external devices and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging offers good thermal performance and mechanical stability, enhancing the reliability of the microcontroller.

Minimum Supply Voltage: 3 V

Wide range of supply voltage allows for flexibility in power configurations, catering to different power sources.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability in harsh environments or industrial applications.

CPU Family: CORTEX-M3

Part of the ARM Cortex-M3 family known for high performance and energy efficiency, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments without sacrificing performance.

ADC Channels: YES

Integrated ADC channels enable analog to digital conversion, essential for interfacing with sensors and measuring physical quantities.

Terminal Position: QUAD

Quad terminal positioning facilitates easy soldering and connection to the PCB, simplifying the assembly process.

ROM Words: 32768

Large ROM size allows for storing program instructions and data, accommodating complex applications and algorithms.

Maximum Seated Height: 1 mm

Low seated height is beneficial for applications with space constraints, enabling compact and slim designs.

Width: 6.875 mm

Compact width dimensions contribute to space-saving on the PCB, ideal for designs with limited board area.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for fast processing and real-time operation, suitable for time-critical applications.

Length: 6.875 mm

Compact length dimensions contribute to space-saving on the PCB, ideal for designs with tight board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in industrial environments where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency, making it suitable for a wide range of embedded applications.

RAM Bytes: 8192

Generous RAM size allows for efficient data storage and manipulation, crucial for running complex algorithms and multitasking.

Technology: CMOS

CMOS technology offers low power consumption, extending battery life and reducing overall power requirements.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and improves reliability, making assembly easier and more robust.

Maximum Supply Current: 110 mA

Low supply current consumption helps in reducing power usage, making the microcontroller energy-efficient and cost-effective.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Integrated PWM channels provide precise control over analog signals, essential for motor control and LED dimming applications.

ROM Programmability: FLASH

Flash programmability allows for easy updating of firmware and software, enabling flexibility and future-proofing of the device.

Terminal Pitch: 0.5 mm

Small terminal pitch enables high-density mounting, reducing PCB footprint and allowing for compact designs.

Speed: 50 rpm

Operating speed of 50 rpm ensures rapid execution of tasks, ideal for applications requiring fast response times.

No. of I/O Lines: 28

Adequate number of I/O lines offer versatility in connecting to external devices and peripherals, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers LM3S608-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S608-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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