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LM3S601-EQN50-C2

Texas Instruments

LM3S601-EQN50-C2 by Texas Instruments

LM3S601-EQN50-C2 by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, 8192 bytes of RAM, and a max clock frequency of 0.032 MHz. It is ideal for industrial applications requiring a powerful Cortex-M3 CPU, ADC channels, and PWM capabilities in a compact flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,706 parts In-Stock

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7,706

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Digiode

USA . 4,668 parts In-Stock

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4,668

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Distributors (Availability)

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AZTECH Wire

Italy . 378 parts In-Stock

1+ parts

$13.801

100+ parts

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378

$13.801

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One Stop Electronics

USA . 1,196 parts In-Stock

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$21.000

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1,196

$21.000

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Parana Technologies

USA . 1,784 parts In-Stock

1+ parts

$29.673

100+ parts

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$61.894

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1,784

$29.673

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$61.894

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ChromeModa Solutions

Germany . 4,129 parts In-Stock

1+ parts

$33.340

100+ parts

$27.339

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4,129

$33.340

$27.339

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IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$33.340

100+ parts

$31.673

1k+ parts

$30.006

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692

$33.340

$31.673

$30.006

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DigiPath Technology Company

USA . 2,338 parts In-Stock

1+ parts

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$30.059

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2,338

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$30.059

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Corphita

USA . 562 parts In-Stock

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562

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Microchip USA

USA . 327 parts In-Stock

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327

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Overview

Unlock the power of cutting-edge technology with the LM3S601-EQN50-C2 microcontroller by Texas Instruments. Crafted with precision and expertise, this device offers seamless integration into a wide range of applications. From industrial automation to IoT devices, its advanced features provide unparalleled performance and reliability. Experience the convenience of a high-quality product that exceeds expectations, delivering value and benefits that cater to your unique needs. Trust Texas Instruments to deliver excellence in every aspect, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material ensures durability and protection for the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in production processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the microcontroller can handle a wide range of input power sources, providing flexibility in system design.

Package Shape: SQUARE

Square package shape enables compact and space-efficient integration within electronic devices, optimizing board layout and design.

Bit Size: 32

A 32-bit architecture offers enhanced processing capabilities, allowing for complex computations and multitasking operations in the microcontroller.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable performance and operation of the microcontroller under varying load conditions.

No. of Terminals: 48

Ample number of terminals provide connectivity options for various external components and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

Flatpack package style facilitates easy mounting and heat dissipation, contributing to improved thermal management and overall system reliability.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power utilization and operation of the microcontroller, making it suitable for energy-conscious applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance allows for reliable performance in harsh environmental conditions, expanding the range of possible applications for the microcontroller.

CPU Family: CORTEX-M3

Inclusion of Cortex-M3 CPU family offers advanced processing capabilities and efficient resource utilization, ideal for embedded system applications requiring high performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance ensures reliable functionality in extreme cold environments, making the microcontroller suitable for a wide range of temperature conditions.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and conversion, allowing for sensor interfacing and data acquisition in the microcontroller.

Terminal Position: QUAD

Quad terminal position provides enhanced connectivity options and ease of soldering during installation, streamlining the assembly process for the microcontroller.

ROM Words: 32768

Large ROM capacity of 32768 words allows for ample program storage space, accommodating complex code requirements and algorithms for the microcontroller.

Maximum Seated Height: 1.6 mm

Low maximum seated height profile ensures compatibility with compact device designs and minimizes space constraints in electronic assemblies.

Width: 7 mm

Compact width dimension enables efficient placement and integration of the microcontroller within electronic devices, optimizing board layout and space utilization.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency allows for fast and responsive operation of the microcontroller, delivering high-speed processing capabilities for time-critical applications.

Length: 7 mm

Compact length dimension facilitates space-saving integration of the microcontroller within electronic systems, ensuring efficient use of board space and layout design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding operating environments, making the microcontroller suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient instruction execution and reduced power consumption, ideal for embedded systems with limited power budgets.

RAM Bytes: 8192

Ample RAM capacity of 8192 bytes allows for efficient data storage and manipulation, supporting multitasking operations and data-intensive applications in the microcontroller.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity in the microcontroller, enhancing overall energy efficiency and signal integrity in electronic systems.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical connection and solder joint reliability, ensuring secure and durable interfacing of the microcontroller with external components.

Maximum Supply Current: 110 mA

With a maximum supply current of 110 mA, the microcontroller operates efficiently within specified power limits, ensuring stable performance under varying load conditions.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the microcontroller, supporting long-term system reliability and performance.

PWM Channels: YES

Presence of PWM channels allows for precise control of analog signals and motor speed modulation, enhancing the microcontroller's capability for motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to the microcontroller's firmware and software, supporting flexible and efficient development cycles for embedded applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting of the microcontroller on PCBs, maximizing board space utilization and allowing for compact system designs.

Speed: 50 rpm

With a speed rating of 50 rpm, the microcontroller offers fast processing and response times, suitable for applications that require rapid data handling and computation.

No. of I/O Lines: 36

Ample number of I/O lines provide versatile connectivity options and signal control capabilities, allowing for seamless interfacing with external devices and peripherals in the microcontroller.

Technical Specifications

Microcontrollers LM3S601-EQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S601-EQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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