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LM3S600-IGZ50-C2T

Texas Instruments

LM3S600-IGZ50-C2T by Texas Instruments

LM3S600-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 36 I/O lines, PWM channels, and ADC channels. It operates at a max clock frequency of 0.032 MHz and has ROM programmability for industrial applications. The chip carrier package style with a square shape makes it suitable for compact designs requiring high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,525 parts In-Stock

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4,525

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Digiode

USA . 1,613 parts In-Stock

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1,613

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Distributors (Availability)

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AZTECH Wire

Italy . 649 parts In-Stock

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$6.721

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649

$6.721

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One Stop Electronics

USA . 603 parts In-Stock

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$34.000

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603

$34.000

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Parana Technologies

USA . 44 parts In-Stock

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$47.257

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44

$47.257

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ChromeModa Solutions

Germany . 4,879 parts In-Stock

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$53.098

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$43.540

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4,879

$53.098

$43.540

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IDEA Electronic Components Group

UK . 2,036 parts In-Stock

1+ parts

$53.098

100+ parts

$50.443

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$47.788

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2,036

$53.098

$50.443

$47.788

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Corphita

USA . 4,132 parts In-Stock

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Microchip USA

USA . 3,671 parts In-Stock

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DigiPath Technology Company

USA . 2,142 parts In-Stock

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$47.873

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$47.873

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Overview

Unleash the power of innovation with the LM3S600-IGZ50-C2T microcontroller from Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this microcontroller offers unmatched performance and reliability. With features like Flash ROM programmability, PWM channels, and ADC channels, this chip carrier package provides endless possibilities for your projects. Trust Texas Instruments to provide the tools you need to bring your ideas to life.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller suitable for mass production.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Bit Size: 32

32-bit processing capability provides high performance and efficiency for various applications.

No. of Terminals: 48

Ample number of terminals allow for versatile connectivity options with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal performance and protection for the microcontroller.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes this microcontroller suitable for industrial environments.

ADC Channels: YES

Onboard ADC channels enable analog-to-digital conversion, expanding the range of applications this microcontroller can be used for.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and routing, reducing overall design complexity.

Maximum Seated Height: 1 mm

Low seated height allows for compact designs and space-constrained applications.

Width: 6.875 mm

Narrow width facilitates space-efficient PCB design and integration into small form factor devices.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency enables fast processing speeds and real-time performance.

Length: 6.875 mm

Compact length saves space on the PCB and allows for slim device profiles.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing and low power consumption, making this microcontroller suitable for battery-powered devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient and reliable operation.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and simplifies the manufacturing process.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Onboard PWM channels facilitate precise control of analog components, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization of the microcontroller's functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density PCB designs and ensures reliable electrical connections.

Speed: 50 rpm

High processing speed of 50 rpm enables efficient execution of complex algorithms and tasks.

No. of I/O Lines: 36

Ample number of I/O lines provide versatile connectivity options and enable communication with external devices.

Technical Specifications

Microcontrollers LM3S600-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S600-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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