Loading...

LM3S600-EQN50-C2

Texas Instruments

LM3S600-EQN50-C2 by Texas Instruments

LM3S600-EQN50-C2 by Texas Instruments is a 32-bit microcontroller with 3.3V power supply, 32768 ROM words, and 8192 RAM bytes. Ideal for industrial applications, it operates b/w -40 to 105°C and features PWM channels for precise control in RISC-based systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,232

-

-

-

-

Digiode

USA . 3,207 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,207

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,584 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,584

$7.000

-

-

-

AZTECH Wire

Italy . 804 parts In-Stock

1+ parts

$10.609

100+ parts

-

1k+ parts

-

10k+ parts

-

804

$10.609

-

-

-

Microchip USA

USA . 2,978 parts In-Stock

1+ parts

$15.780

100+ parts

$15.560

1k+ parts

$15.450

10k+ parts

$15.330

2,978

$15.780

$15.560

$15.450

$15.330

Parana Technologies

USA . 2,289 parts In-Stock

1+ parts

$36.364

100+ parts

-

1k+ parts

-

10k+ parts

-

2,289

$36.364

-

-

-

IDEA Electronic Components Group

UK . 625 parts In-Stock

1+ parts

$40.858

100+ parts

$38.815

1k+ parts

$36.772

10k+ parts

-

625

$40.858

$38.815

$36.772

-

ChromeModa Solutions

Germany . 231 parts In-Stock

1+ parts

$40.858

100+ parts

$33.504

1k+ parts

-

10k+ parts

-

231

$40.858

$33.504

-

-

DigiPath Technology Company

USA . 208 parts In-Stock

1+ parts

-

100+ parts

$36.838

1k+ parts

-

10k+ parts

-

208

-

$36.838

-

-

Corphita

USA . 119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

119

-

-

-

-

Overview

Unlock endless possibilities with the LM3S600-EQN50-C2 microcontroller by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions in the field of microcontrollers. This versatile device is perfect for a wide range of applications, providing unparalleled performance and efficiency. Whether you're developing IoT devices, robotics, or industrial automation systems, the LM3S600-EQN50-C2 offers unmatched value, benefits, and advantages to meet all your needs. Experience seamless integration and superior functionality with this powerhouse of a microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the package, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle a wide range of power supply voltages, increasing its versatility.

Package Shape: SQUARE

The square package shape helps with efficient space utilization on the PCB and makes the microcontroller easy to mount.

Bit Size: 32

A 32-bit architecture provides high-performance processing capabilities for complex tasks and applications.

Power Supplies (V): 3.3

A stable power supply voltage of 3.3 V ensures reliable operation of the microcontroller and connected components.

No. of Terminals: 48

Having 48 terminals allows for easy connection of external components and peripherals, enhancing the microcontroller's functionality.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with a wide range of power sources, making it versatile in different applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance even in harsh environments.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family offers high performance and efficiency, making this microcontroller suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold environments.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital data, enabling sensor interfacing and data acquisition.

ROM Words: 32768

With 32768 ROM words, the microcontroller has ample memory to store program instructions and data.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for slim and compact device designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller with various peripherals, it offers efficient processing and interfacing capabilities for a wide range of applications.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can store and manipulate data efficiently during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

The GULL WING terminal form facilitates easy soldering and PCB mounting, ensuring reliable connections.

Maximum Clock Frequency: 0.032 MHz

A maximum clock frequency of 32 MHz allows for high-speed processing and execution of instructions.

PWM Channels: YES

Having PWM channels enables precise control of analog devices such as motors and LEDs, expanding the microcontroller's application capabilities.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast updating of firmware, making the microcontroller flexible and adaptable to changing requirements.

Technical Specifications

Microcontrollers LM3S600-EQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S600-EQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20