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LM3S5T36-IQR80-C1T

Texas Instruments

LM3S5T36-IQR80-C1T by Texas Instruments

Texas Instruments' LM3S5T36-IQR80-C1T microcontroller features 32-bit architecture, 64 terminals, and operates at a max clock frequency of 0.032 MHz. Ideal for industrial applications requiring ADC and DMA channels, with ROM programmability and PWM support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,260 parts In-Stock

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4,260

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Vyrian

USA . 3,883 parts In-Stock

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3,883

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Distributors (Availability)

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One Stop Electronics

USA . 1,382 parts In-Stock

1+ parts

$3.000

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1,382

$3.000

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AZTECH Wire

Italy . 477 parts In-Stock

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$11.367

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477

$11.367

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Parana Technologies

USA . 1,574 parts In-Stock

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$20.431

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$20.480

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1,574

$20.431

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$20.480

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DigiPath Technology Company

USA . 1,827 parts In-Stock

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$22.497

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1,827

$22.497

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ChromeModa Solutions

Germany . 1,596 parts In-Stock

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$22.956

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$18.824

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1,596

$22.956

$18.824

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IDEA Electronic Components Group

UK . 916 parts In-Stock

1+ parts

$22.956

100+ parts

$21.808

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$20.660

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916

$22.956

$21.808

$20.660

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Corphita

USA . 2,835 parts In-Stock

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Microchip USA

USA . 268 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S5T36-IQR80-C1T by Texas Instruments. This cutting-edge microcontroller boasts top-notch quality and reliability from a trusted manufacturer. Ideal for a wide range of applications, this product offers unparalleled value with its advanced features like ADC and DMA channels, PWM capabilities, and high clock frequency. Whether you're designing IoT devices, robotics, or industrial automation systems, this microcontroller delivers seamless performance and efficiency to elevate your projects to new heights. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Facilitates easy and efficient installation of the microcontroller onto circuit boards.

Maximum Supply Voltage: 1.32 V

Supports a higher supply voltage, allowing for greater flexibility in power requirements.

Package Shape: SQUARE

Square shape helps in efficient use of space on the circuit board.

Bit Size: 32

Offers a high bit size, allowing for complex computations and data processing capabilities.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): FLATPACK

Flatpack design enables easy and secure mounting of the microcontroller on the circuit board.

Minimum Supply Voltage: 1.08 V

Supports a lower supply voltage, helping in reducing power consumption and heat dissipation.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures, making it suitable for industrial applications where heat may be a concern.

ADC Channels: YES

Integrated Analog-to-Digital Converter (ADC) allows for accurate conversion of analog signals to digital data.

DMA Channels: YES

Supports Direct Memory Access (DMA) for efficient data transfer between peripherals, enhancing overall performance.

Terminal Position: QUAD

Quad terminal position offers better stability and connectivity for the microcontroller.

Maximum Seated Height: 1.6 mm

Low seated height helps in compact design of the overall system.

Width: 10 mm

Compact width allows for space-efficient placement on the circuit board.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast processing speed and responsiveness.

Length: 10 mm

Compact length complements the width for a space-efficient design.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with high temperature variations.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller for versatile embedded system applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and secure soldering connection.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance under varying load conditions.

PWM Channels: YES

Integrated Pulse Width Modulation (PWM) channels for precise control of analog signals.

ROM Programmability: FLASH

FLASH ROM programmability allows for easy firmware updates and customization of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging and optimal use of space on the circuit board.

Speed: 80 rpm

Operates at a high speed of 80 revolutions per minute, suitable for time-critical applications.

No. of I/O Lines: 33

Offers a sufficient number of Input/Output (I/O) lines for versatile connectivity with external devices.

Technical Specifications

Microcontrollers LM3S5T36-IQR80-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5T36-IQR80-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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