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LM3S5R31-IQC80-C5T

Texas Instruments

LM3S5R31-IQC80-C5T by Texas Instruments

LM3S5R31-IQC80-C5T by Texas Instruments is a 32-bit microcontroller with 67 I/O lines, 16 MHz clock frequency, and ADC/DMA channels. Ideal for industrial applications requiring a max supply voltage of 3.6V and operating temperature up to 85°C. Package style is flatpack with gull wing terminals in a square shape measuring 14mm x 14mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,376 parts In-Stock

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Digiode

USA . 2,672 parts In-Stock

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2,672

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Distributors (Availability)

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AZTECH Wire

Italy . 534 parts In-Stock

1+ parts

$13.106

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534

$13.106

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One Stop Electronics

USA . 1,158 parts In-Stock

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$18.000

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Parana Technologies

USA . 762 parts In-Stock

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$51.174

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762

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ChromeModa Solutions

Germany . 2,650 parts In-Stock

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$57.499

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$47.149

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2,650

$57.499

$47.149

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IDEA Electronic Components Group

UK . 1,704 parts In-Stock

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$57.499

100+ parts

$54.624

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$51.749

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1,704

$57.499

$54.624

$51.749

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Corphita

USA . 2,681 parts In-Stock

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2,681

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DigiPath Technology Company

USA . 1,234 parts In-Stock

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$51.841

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Microchip USA

USA . 214 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S5R31-IQC80-C5T microcontroller by Texas Instruments. Crafted with precision and expertise, this cutting-edge device offers endless possibilities for your projects. From industrial automation to consumer electronics, this versatile microcontroller delivers unmatched performance and reliability. With a 32-bit architecture and advanced features like ADC and DMA channels, this product is designed to elevate your designs to new heights. Trust Texas Instruments to deliver quality and value in every aspect of your project. Experience the difference with the LM3S5R31-IQC80-C5T microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

Square package shape facilitates uniform placement on the PCB, optimizing board layout and saving space.

Bit Size: 32

32-bit architecture provides faster processing and enhanced performance compared to lower bit sizes, suitable for complex applications.

No. of Terminals: 100

Having 100 terminals allows for a large number of connections and peripherals to be interfaced with the microcontroller, enabling versatile functionality.

Package Style (Meter): FLATPACK

Flatpack package style offers a low profile and efficient heat dissipation, enhancing reliability and performance of the microcontroller.

Minimum Supply Voltage: 3 V

Operating at a minimum supply voltage of 3V ensures efficient power consumption and compatibility with low voltage applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand high temperature environments, suitable for industrial applications.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, enabling accurate sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, improving overall performance and responsiveness of the microcontroller.

Terminal Position: QUAD

Quad terminal position enables easy soldering and secure mounting on the PCB, ensuring reliable connections and durability.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6 mm saves space and allows for compact PCB designs, ideal for applications with size constraints.

Width: 14 mm

Compact width of 14 mm enables easy integration into tight spaces, suitable for applications where size is a critical factor.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz provides high-speed processing capability, suitable for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum peak reflow time of 30 seconds, the microcontroller can withstand reflow soldering processes without compromising performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable solder joints and stability during the soldering process, enhancing overall durability.

Length: 14 mm

Compact length of 14 mm enables efficient board layout and space-saving design, suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments and broadens the range of applications where the microcontroller can be used.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals on a single chip, offering a complete solution for control and processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing energy efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and strong mechanical connections, ensuring long-lasting performance and robustness.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures stability and compatibility with common power sources, simplifying system integration.

PWM Channels: YES

Integrated PWM channels enable precise control of analog outputs, making the microcontroller suitable for applications requiring motor control or dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating of firmware and customization of code, ensuring flexibility and adaptability of the microcontroller.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5 mm saves space on the PCB and enables high-density mounting, ideal for compact and miniaturized applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand standard moisture exposure during storage and handling, ensuring product reliability.

Speed: 80 rpm

Operating at a speed of 80 rpm, the microcontroller is suitable for applications that require precise timing and control of mechanical components.

No. of I/O Lines: 67

Having 67 I/O lines provides flexibility for interfacing with external devices and peripherals, enabling versatile connectivity and control options.

Technical Specifications

Microcontrollers LM3S5R31-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5R31-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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