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LM3S5R31-IQC80-C5

Texas Instruments

LM3S5R31-IQC80-C5 by Texas Instruments

LM3S5R31-IQC80-C5 by Texas Instruments is a 32-bit microcontroller with 67 I/O lines, 16 MHz clock frequency, and ADC/DMA channels. Ideal for industrial applications requiring a max supply voltage of 3.6 V and operating temperature up to 85°C. Package style is flatpack with gull wing terminals in a square shape measuring 14mm x 14mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,468 parts In-Stock

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Digiode

USA . 1,630 parts In-Stock

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1,630

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One Stop Electronics

USA . 1,615 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 572 parts In-Stock

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$19.147

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572

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Parana Technologies

USA . 414 parts In-Stock

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$57.182

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414

$57.182

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DigiPath Technology Company

USA . 49 parts In-Stock

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$62.965

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$57.928

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49

$62.965

$57.928

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ChromeModa Solutions

Germany . 3,458 parts In-Stock

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$64.250

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$52.685

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$64.250

$52.685

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IDEA Electronic Components Group

UK . 536 parts In-Stock

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$64.250

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$61.038

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$57.825

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536

$64.250

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$57.825

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Corphita

USA . 2,619 parts In-Stock

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Lixinc

USA . 1,967 parts In-Stock

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A-Z Elektronik GmbH

Germany . 191 parts In-Stock

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Perfect Parts

USA . 138 parts In-Stock

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Microchip USA

USA . 126 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S5R31-IQC80-C5 microcontroller by Texas Instruments. This cutting-edge device offers unmatched quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this microcontroller delivers exceptional value and performance to customers looking to take their projects to the next level. Experience seamless operation and endless possibilities with the LM3S5R31-IQC80-C5 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while staying within a safe operating range.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to read analog signals, expanding its range of applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, enabling quick updates and changes to the firmware.

Maximum Clock Frequency: 16 MHz

A high clock frequency allows for faster processing speeds and better performance in demanding applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals on a single chip, simplifying system design and saving space.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller efficient and reliable.

Technical Specifications

Microcontrollers LM3S5R31-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5R31-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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