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LM3S5K36-IQR80-C5

Texas Instruments

LM3S5K36-IQR80-C5 by Texas Instruments

LM3S5K36-IQR80-C5 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 24576 RAM bytes, and 33 I/O lines. It operates at a max clock frequency of 16 MHz and has PWM channels for industrial applications requiring high-speed processing and precise control. With a compact square package style and low power consumption of 129 mA at 3.3 V, it is suitable for embedded systems in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,920 parts In-Stock

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Digiode

USA . 4,888 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 359 parts In-Stock

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$18.772

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359

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One Stop Electronics

USA . 553 parts In-Stock

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$30.000

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Parana Technologies

USA . 2,243 parts In-Stock

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$63.539

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ChromeModa Solutions

Germany . 4,996 parts In-Stock

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$71.392

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$58.541

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IDEA Electronic Components Group

UK . 1,907 parts In-Stock

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$71.392

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$67.822

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$64.253

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Lixinc

USA . 17,700 parts In-Stock

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Corphita

USA . 4,246 parts In-Stock

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Microchip USA

USA . 483 parts In-Stock

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DigiPath Technology Company

USA . 436 parts In-Stock

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$64.367

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Perfect Parts

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Overview

Step into the future with the LM3S5K36-IQR80-C5 from Texas Instruments, a leading manufacturer of high-quality microcontrollers. These powerful devices offer endless possibilities in various applications, providing unmatched value and benefits to customers. Whether you are looking to enhance your industrial automation systems, robotics projects, or IoT solutions, this microcontroller's advanced features and reliability will set you apart from the competition. Embrace innovation and unlock new opportunities with the LM3S5K36-IQR80-C5 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, making it versatile for different power requirements.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Bit Size: 32

32-bit architecture provides high processing power and performance for the microcontroller.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options, allowing for flexibility in power management.

No. of Terminals: 64

64 terminals provide ample connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK

Flatpack package style is compact and space-efficient for PCB design.

Minimum Supply Voltage: 3 V

Supports a minimum supply voltage of 3V, ensuring compatibility with a wide range of power sources.

CPU Family: CORTEX-M3

Belonging to the Cortex-M3 CPU family ensures reliable and efficient performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range of -40 to 85°C makes it suitable for various environmental conditions.

ADC Channels: YES

Built-in ADC channels allow for analog sensor interfacing and data conversion.

DMA Channels: YES

DMA channels enable efficient data transfer and processing, improving overall system performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good electrical conductivity and solderability.

ROM Words: 131072

Large ROM size of 131072 words provides ample space for program storage and code execution.

Width: 10 mm

Compact width of 10mm saves space on the PCB and allows for more efficient board layout.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16MHz enables fast processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 30

Supports reflow soldering process with a maximum time of 30 seconds at peak temperature.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable solder joints during assembly.

Length: 10 mm

Compact length of 10mm helps in saving space and optimizing PCB layout.

Temperature Grade: INDUSTRIAL

Designed for industrial environments with a wide operating temperature range and robust construction.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and functions in a single chip for a compact system design.

RAM Bytes: 24576

Generous amount of RAM (24576 bytes) for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form enables easy PCB mounting and rework, enhancing assembly and maintenance processes.

Maximum Supply Current: 129 mA

Supports a maximum supply current of 129mA for reliable and stable operation.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage of 3.3V ensures compatibility with common power sources.

PWM Channels: YES

PWM channels allow for precise control of motor speed, LED brightness, and other applications requiring pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and customization of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for compact packaging and high-density PCB design.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly.

Speed: 80 rpm

Support for 80 revolutions per minute (rpm) speed, suitable for controlling motors and other rotational devices.

No. of I/O Lines: 33

33 I/O lines provide ample interfacing options for external devices and peripherals, increasing system flexibility.

Technical Specifications

Microcontrollers LM3S5K36-IQR80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5K36-IQR80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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