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LM3S5K31-IQC80-C3

Texas Instruments

LM3S5K31-IQC80-C3 by Texas Instruments

LM3S5K31-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 100 terminals, operating at a max frequency of 16 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a supply voltage b/w 3V to 3.6V. The package style is flatpack with gull wing terminals, making it ideal for compact designs in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,865 parts In-Stock

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Digiode

USA . 1,495 parts In-Stock

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1,495

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Distributors (Availability)

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AZTECH Wire

Italy . 668 parts In-Stock

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$10.786

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668

$10.786

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Parana Technologies

USA . 1,052 parts In-Stock

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$15.795

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$16.154

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1,052

$15.795

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$16.154

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DigiPath Technology Company

USA . 1,088 parts In-Stock

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$17.392

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1,088

$17.392

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ChromeModa Solutions

Germany . 6,259 parts In-Stock

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$17.747

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$14.553

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6,259

$17.747

$14.553

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IDEA Electronic Components Group

UK . 1,016 parts In-Stock

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$17.747

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$16.860

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$15.972

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1,016

$17.747

$16.860

$15.972

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One Stop Electronics

USA . 807 parts In-Stock

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$18.000

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807

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QUARKTWIN TECHNOLOGY LTD

USA . 27,748 parts In-Stock

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Corphita

USA . 1,380 parts In-Stock

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Microchip USA

USA . 428 parts In-Stock

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Overview

Revolutionize your projects with the LM3S5K31-IQC80-C3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality microcontrollers that guarantee reliability and performance. Ideal for a wide range of applications, this microcontroller offers unmatched value with its advanced features like ADC and DMA channels, PWM capabilities, and ROM programmability. Say goodbye to limitations and hello to endless possibilities with the LM3S5K31-IQC80-C3 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction for the microcontroller.

Surface Mount: YES

Ensures easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power requirements.

Bit Size: 32

Offers a higher processing capability and performance for complex tasks and calculations.

No. of Terminals: 100

Provides a sufficient number of terminals for connecting various components and peripherals.

Package Style (Meter): FLATPACK

Enables easy mounting and handling during production and assembly processes.

Maximum Operating Temperature: 85 °C

Allows the microcontroller to operate efficiently in a wide range of temperature environments.

ADC Channels: YES

Enables analog-to-digital conversion functionality for interfacing with sensors and external signals.

DMA Channels: YES

Facilitates efficient data transfer and processing without CPU intervention, enhancing overall system performance.

Terminal Position: QUAD

Provides a standard terminal configuration for easy integration and compatibility with other components.

Maximum Seated Height: 1.6 mm

Offers a low-profile design for compact electronic applications with space constraints.

Width: 14 mm

Provides a compact form factor for integration into small electronic devices or systems.

Maximum Clock Frequency: 16 MHz

Delivers high-speed processing capabilities for demanding real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a reduced instruction set computing architecture for efficient and optimized performance.

Technology: CMOS

Employs complementary metal-oxide-semiconductor technology for low power consumption and high noise immunity.

Nominal Supply Voltage: 3.3 V

Provides a stable supply voltage for reliable operation and performance.

PWM Channels: YES

Supports pulse-width modulation for precise control of analog outputs such as motor speed or LED brightness.

ROM Programmability: FLASH

Enables reprogrammable memory for firmware updates and flexibility in application development.

Terminal Pitch: 0.5 mm

Offers a fine pitch for compact PCB layouts and increased routing density.

Moisture Sensitivity Level (MSL): 3

Indicates a moderate level of moisture sensitivity for proper handling and storage during assembly.

Speed: 80 rpm

Provides a speed specification for motor control applications or timing functions.

No. of I/O Lines: 67

Offers a sufficient number of input/output lines for versatile connectivity and interfacing with external devices.

Technical Specifications

Microcontrollers LM3S5K31-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5K31-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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