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LM3S5G36-IQR80-A2T

Texas Instruments

LM3S5G36-IQR80-A2T by Texas Instruments

LM3S5G36-IQR80-A2T by Texas Instruments is a 32-bit microcontroller with 393216 ROM words and 65536 RAM bytes. It operates b/w -40 to 85°C, suitable for industrial applications. With a peak reflow temperature of 260°C, it is ideal for high-speed processing tasks in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,148 parts In-Stock

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6,148

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Digiode

USA . 69 parts In-Stock

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69

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Distributors (Availability)

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AZTECH Wire

Italy . 742 parts In-Stock

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$13.291

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742

$13.291

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Parana Technologies

USA . 1,675 parts In-Stock

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$13.888

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$14.369

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1,675

$13.888

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$14.369

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DigiPath Technology Company

USA . 734 parts In-Stock

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$15.292

100+ parts

$14.069

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734

$15.292

$14.069

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ChromeModa Solutions

Germany . 3,358 parts In-Stock

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$15.604

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$12.795

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3,358

$15.604

$12.795

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IDEA Electronic Components Group

UK . 353 parts In-Stock

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$15.604

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$14.824

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$14.044

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353

$15.604

$14.824

$14.044

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One Stop Electronics

USA . 1,357 parts In-Stock

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$31.000

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1,357

$31.000

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Microchip USA

USA . 7,976 parts In-Stock

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Corphita

USA . 2,906 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S5G36-IQR80-A2T microcontroller from Texas Instruments. Designed for high-performance applications, this cutting-edge device boasts a 32-bit Cortex-M3 CPU family and 393216 ROM words, delivering unparalleled speed and efficiency. With a durable plastic/epoxy package body and industrial-grade temperature grade, this microcontroller is built to last in even the harshest environments. Whether you're developing smart home devices, automotive systems, or industrial automation solutions, the LM3S5G36-IQR80-A2T offers unmatched value, reliability, and performance for all your electronic projects. Elevate your designs to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy installation and soldering onto PCBs, making it efficient for manufacturing processes.

Bit Size: 32

Higher bit size allows for more complex processing and calculations to be performed by the microcontroller.

Power Supplies (V): 1.3,3.3

The availability of multiple power supply options allows for flexibility in different application requirements.

No. of Terminals: 64

Having a high number of terminals provides ample connectivity options for interfacing with other components and peripherals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications where temperature variations are common.

CPU Family: CORTEX-M3

Belonging to the CORTEX-M3 family ensures high performance and efficiency in processing tasks.

RAM Bytes: 65536

Having a large RAM size allows for efficient data storage and retrieval during operation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

ROM Programmability: FLASH

Flash programmability enables easy and quick updates to the microcontroller's firmware.

Technical Specifications

Microcontrollers LM3S5G36-IQR80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQFP-G64

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

LM3S5G36-IQR80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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