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LM3S5D51-IQC80-A2

Texas Instruments

LM3S5D51-IQC80-A2 by Texas Instruments

Texas Instruments LM3S5D51-IQC80-A2 is a 32-bit microcontroller with Cortex-M3 CPU, 16-Ch 12-Bit ADC, and 6 PWM channels. Ideal for industrial applications, it offers CAN, I2C, SPI connectivity options and operates at up to 16.384 MHz clock frequency.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,872 parts In-Stock

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Digiode

USA . 4,363 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 832 parts In-Stock

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$18.172

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832

$18.172

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Parana Technologies

USA . 2,333 parts In-Stock

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$28.055

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$43.208

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DigiPath Technology Company

USA . 1,351 parts In-Stock

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$30.892

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IDEA Electronic Components Group

UK . 1,232 parts In-Stock

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$31.522

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$29.946

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$28.370

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$31.522

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ChromeModa Solutions

Germany . 927 parts In-Stock

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$31.522

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$25.848

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927

$31.522

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One Stop Electronics

USA . 651 parts In-Stock

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$32.000

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651

$32.000

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Lixinc

USA . 5,679 parts In-Stock

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Perfect Parts

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Corphita

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Microchip USA

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Overview

Discover the LM3S5D51-IQC80-A2 by Texas Instruments, a high-quality microcontroller designed to exceed your expectations. With a wide range of applications in various industries, this product offers unmatched value and benefits to customers. From its reliable manufacturer to its cutting-edge technology, the LM3S5D51-IQC80-A2 delivers superior performance, efficiency, and versatility. Upgrade your projects with this exceptional microcontroller and experience the advantages it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology makes the microcontroller easy to mount on PCBs, saving space and allowing for automated assembly in manufacturing.

Maximum Supply Voltage: 1.365 V

Having a maximum supply voltage of 1.365 V ensures compatibility with low-power applications and helps in reducing overall power consumption.

Package Shape: SQUARE

Square package shape provides a compact form factor, making it suitable for space-constrained designs.

Bit Size: 32

32-bit architecture allows for high-performance computing and more efficient processing of data compared to lower bit sizes.

Power Supplies (V): 1.3,3.3

Flexibility in power supply options allows for compatibility with a wide range of devices and systems that require different operating voltages.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with external components and peripherals.

Minimum Supply Voltage: 1.235 V

Low minimum supply voltage ensures efficient operation in low-power applications without compromising performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C enables reliable operation even in harsh environmental conditions.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family indicates a high level of performance, efficiency, and compatibility with a wide range of software tools and libraries.

ADC Channels: YES

Built-in ADC channels allow for analog signal conversion, making the microcontroller suitable for applications that require analog input processing.

DMA Channels: YES

DMA channels enable efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Having a RISC microcontroller architecture ensures high performance and energy efficiency, making it suitable for a wide range of applications.

Connectivity: CAN(2), I2C(2), I2S, IRDA, LIN, MICROWIRE, SPI, SSI(2), UART(3), USB

Multiple connectivity options such as CAN, I2C, SPI, and UART allow for easy interfacing with external devices and communication protocols, enhancing the device's versatility.

RAM Bytes: 98304

Ample RAM capacity of 98304 bytes enables efficient data storage and manipulation, supporting complex algorithms and multitasking operations.

Technical Specifications

Microcontrollers LM3S5D51-IQC80-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

67

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), I2S, IRDA, LIN, MICROWIRE, SPI, SSI(2), UART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM(6), QEI(2), RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

LM3S5D51-IQC80-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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