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LM3S5C56-IQR80-A2T

Texas Instruments

LM3S5C56-IQR80-A2T by Texas Instruments

LM3S5C56-IQR80-A2T by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 16.348 MHz. It features 65536 bytes of RAM, ADC and DMA channels, and ROM programmability for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,899 parts In-Stock

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Digiode

USA . 434 parts In-Stock

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434

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AZTECH Wire

Italy . 278 parts In-Stock

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$10.411

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$10.411

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One Stop Electronics

USA . 826 parts In-Stock

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$32.000

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Parana Technologies

USA . 1,491 parts In-Stock

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$47.121

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DigiPath Technology Company

USA . 726 parts In-Stock

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$51.886

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726

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ChromeModa Solutions

Germany . 2,601 parts In-Stock

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$52.945

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$43.415

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2,601

$52.945

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IDEA Electronic Components Group

UK . 2,129 parts In-Stock

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$52.945

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$50.298

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$47.650

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2,129

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Corphita

USA . 1,210 parts In-Stock

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Microchip USA

USA . 390 parts In-Stock

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Overview

Unlock the potential of your next project with the LM3S5C56-IQR80-A2T microcontroller from Texas Instruments. With a powerful 32-bit Cortex-M3 CPU and a wide range of peripherals, this device offers unparalleled performance and flexibility. Whether you're designing industrial automation systems or IoT devices, this microcontroller delivers the reliability and efficiency you need. Trust in Texas Instruments' reputation for quality and innovation, and experience the difference in your applications. Elevate your designs with the LM3S5C56-IQR80-A2T microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller chip.

Surface Mount: YES

Allows for easy and secure mounting on PCBs.

Maximum Supply Voltage: 1.365 V

Supports a low maximum supply voltage for power efficiency.

Package Shape: SQUARE

Helps in easy placement and alignment during PCB assembly.

Bit Size: 32

Offers a 32-bit architecture for enhanced processing capabilities.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options for flexibility in design.

No. of Terminals: 64

Provides ample connectivity options for interfacing with other components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Different package styles offer versatility for various PCB layouts.

Minimum Supply Voltage: 1.235 V

Allows for operation at low supply voltages, conserving power.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without compromise.

CPU Family: CORTEX-M3

Belongs to the efficient Cortex-M3 CPU family for reliable performance.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions for versatile applications.

ADC Channels: YES

Includes Analog-to-Digital Converter channels for sensor interfacing.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfer.

Terminal Position: QUAD

Quad terminal position allows for easy connectivity in all directions.

ROM Words: 524288

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low-profile design for space-constrained PCB applications.

Width: 10 mm

Compact width for fitting in tight spaces on the PCB.

Maximum Clock Frequency: 16.348 MHz

High clock frequency for speedy processing of instructions.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with a short time duration.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for soldering processes.

Length: 10 mm

Compact length for fitting in small board spaces.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges for robust applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller for efficient and streamlined processing.

RAM Bytes: 65536

Ample RAM capacity for temporary data storage during operations.

Technology: CMOS

CMOS technology for low power consumption and high speed.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and connections.

Maximum Supply Current: 135 mA

Low maximum supply current for power efficiency.

Nominal Supply Voltage: 1.3 V

Nominal supply voltage for stable operation.

PWM Channels: YES

Supports Pulse Width Modulation channels for precise control.

ROM Programmability: FLASH

Flash ROM programmability for easy updating and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for accurate PCB soldering.

Moisture Sensitivity Level (MSL): 3

Rated MSL 3 for moderate moisture sensitivity levels during storage.

Speed: 80 rpm

Operates at a speed of 80 rotations per minute for time-critical applications.

No. of I/O Lines: 33

33 I/O lines for versatile connectivity options with external devices.

Technical Specifications

Microcontrollers LM3S5C56-IQR80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.348 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5C56-IQR80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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