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LM3S5B91-IQC80-C5T

Texas Instruments

LM3S5B91-IQC80-C5T by Texas Instruments

LM3S5B91-IQC80-C5T by Texas Instruments is a 32-bit Cortex-M3 microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16.384 MHz, making it ideal for industrial applications requiring high-speed processing and efficient memory management. With features like ADC and DMA channels, this microcontroller offers versatile functionality for various embedded systems projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,258 parts In-Stock

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7,258

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Chip Stock

USA . 5,250 parts In-Stock

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5,250

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Digiode

USA . 3,884 parts In-Stock

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3,884

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Distributors (Availability)

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One Stop Electronics

USA . 1,556 parts In-Stock

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$12.000

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1,556

$12.000

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AZTECH Wire

Italy . 636 parts In-Stock

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$12.881

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636

$12.881

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Parana Technologies

USA . 1,669 parts In-Stock

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$62.550

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$62.550

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DigiPath Technology Company

USA . 1,073 parts In-Stock

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$68.875

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1,073

$68.875

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ChromeModa Solutions

Germany . 4,625 parts In-Stock

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$70.281

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$57.630

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$70.281

$57.630

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IDEA Electronic Components Group

UK . 358 parts In-Stock

1+ parts

$70.281

100+ parts

$66.767

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$63.253

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358

$70.281

$66.767

$63.253

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Authorized Procurement Solutions

USA . 47,480 parts In-Stock

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47,480

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Lixinc

USA . 15,934 parts In-Stock

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Perfect Parts

USA . 6,156 parts In-Stock

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Corphita

USA . 1,454 parts In-Stock

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Microchip USA

USA . 262 parts In-Stock

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Overview

Unlock a world of endless possibilities with the LM3S5B91-IQC80-C5T microcontroller by Texas Instruments. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides seamless integration and efficient operation. Embrace innovation and streamline your projects with the unmatched quality and value of Texas Instruments. Elevate your creations today with the LM3S5B91-IQC80-C5T microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.365 V

Ensures stable voltage operation within the specified range, preventing damage to the device.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space and easy alignment during assembly.

Bit Size: 32

A 32-bit processor offers high computational power and performance for complex tasks and applications.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options, providing flexibility in system design and voltage compatibility.

No. of Terminals: 100

Sufficient number of terminals for connecting various peripherals and external components in a system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Multiple package styles offer versatility in mounting and integration options for different PCB layouts.

Minimum Supply Voltage: 1.235 V

Allows the device to operate at low voltages, saving power and optimizing energy efficiency.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures, ensuring reliability in harsh environments or industrial applications.

CPU Family: CORTEX-M3

Utilizes ARM Cortex-M3 architecture, known for its efficient and high-performance computing capabilities.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions without compromising performance or reliability.

ADC Channels: YES

Integrated analog-to-digital converters enable accurate measurement and conversion of analog signals.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer and processing, improving system performance.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections on the PCB, reducing the risk of signal interference.

ROM Words: 262144

Large ROM size for storing program instructions and data, necessary for complex applications and tasks.

Maximum Seated Height: 1.6 mm

Low profile design saves space and facilitates slim device designs for compact electronic products.

Width: 14 mm

Compact width size suitable for various PCB layouts and space-constrained applications.

Maximum Clock Frequency: 16.384 MHz

High clock frequency supports fast processing and real-time data handling in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Long reflow time allows for proper soldering of the component during PCB assembly, ensuring stable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for lead-free soldering processes and reliable PCB assembly.

Length: 14 mm

Compact length size suitable for space-constrained PCB designs and electronic products.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature reliability ensures stable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and streamlined processing for quick execution of tasks in embedded systems.

RAM Bytes: 98304

Sufficient RAM capacity for data storage and processing, enabling seamless multitasking and operation.

Technology: CMOS

CMOS technology provides low power consumption and high integration levels, ideal for energy-efficient devices.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure mounting on PCBs for reliable connections.

Maximum Supply Current: 129 mA

Capable of providing sufficient current for device operation without exceeding the specified limit.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage for consistent and reliable performance in various operating conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals for applications like motor control or LED dimming.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware without the need for external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting on PCBs, optimizing space usage and layout design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Speed: 80 rpm

High-speed processing capability for quick response times and efficient operation in time-critical applications.

No. of I/O Lines: 72

Sufficient number of I/O lines for connecting peripherals, sensors, and external components in an embedded system.

Technical Specifications

Microcontrollers LM3S5B91-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

129 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5B91-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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