Loading...

LM3S5B91-IQC80-C3

Texas Instruments

LM3S5B91-IQC80-C3 by Texas Instruments

LM3S5B91-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 72 I/O lines, PWM and ADC channels. Operating at up to 0.032 MHz, it's ideal for industrial applications requiring high-speed data processing. With a compact square package style and low supply voltage range of 1.08V to 1.32V, this microcontroller offers versatile performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,775

-

-

-

-

Digiode

USA . 921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

921

-

-

-

-

Prism Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 193 parts In-Stock

1+ parts

$12.164

100+ parts

-

1k+ parts

-

10k+ parts

-

193

$12.164

-

-

-

One Stop Electronics

USA . 284 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

-

284

$20.000

-

-

-

Parana Technologies

USA . 855 parts In-Stock

1+ parts

$33.208

100+ parts

-

1k+ parts

$120.815

10k+ parts

-

855

$33.208

-

$120.815

-

ChromeModa Solutions

Germany . 4,757 parts In-Stock

1+ parts

$37.312

100+ parts

$30.596

1k+ parts

-

10k+ parts

-

4,757

$37.312

$30.596

-

-

IDEA Electronic Components Group

UK . 811 parts In-Stock

1+ parts

$37.312

100+ parts

$35.446

1k+ parts

$33.581

10k+ parts

-

811

$37.312

$35.446

$33.581

-

Authorized Procurement Solutions

USA . 31,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

31,500

-

-

-

-

Lixinc

USA . 14,555 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,555

-

-

-

-

DigiPath Technology Company

USA . 2,182 parts In-Stock

1+ parts

-

100+ parts

$33.640

1k+ parts

-

10k+ parts

-

2,182

-

$33.640

-

-

Corphita

USA . 498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

498

-

-

-

-

Microchip USA

USA . 310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

310

-

-

-

-

Overview

Elevate your projects with the LM3S5B91-IQC80-C3 by Texas Instruments, a top-of-the-line microcontroller designed to deliver unparalleled performance and reliability. From industrial automation to consumer electronics, this cutting-edge device offers endless possibilities for innovation. With advanced features like ADC and DMA channels, along with ROM programmability and PWM support, this microcontroller ensures seamless operation and optimal functionality. Trust in Texas Instruments' renowned quality and expertise to bring your ideas to life with the LM3S5B91-IQC80-C3.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto a PCB, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.32 V

Allows for flexibility in power supply options while ensuring safe operation within specified limits.

Package Shape: SQUARE

Square package shape simplifies placement and orientation on the PCB, aiding in efficient board design.

Bit Size: 32

32-bit architecture provides high computational power and versatility for various applications.

No. of Terminals: 100

Sufficient number of terminals for connectivity options and interfacing with external components.

Package Style (Meter): FLATPACK

Flatpack package style offers good thermal performance and reliability during operation.

Minimum Supply Voltage: 1.08 V

Low minimum supply voltage allows for efficient power consumption and extended battery life in portable devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications with potential temperature variations.

ADC Channels: YES

Integrated ADC channels enable analog signal conversion for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels provide efficient data transfer between memory and peripherals, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easy PCB layout and routing for improved signal integrity.

Maximum Seated Height: 1.6 mm

Low seated height is beneficial for compact PCB designs and space-constrained applications.

Width: 14 mm

Compact width size contributes to space-saving on the PCB, allowing for dense component placement.

Maximum Clock Frequency: 0.032 MHz

High clock frequency capability supports fast processing and execution of instructions in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Able to withstand peak reflow temperatures for sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering and assembly during manufacturing.

Length: 14 mm

Compact length size aids in space optimization on the PCB and efficient board layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions often found in industrial settings.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller, providing dedicated processing and control capabilities for embedded systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance for various applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and assembly processes, enhancing overall reliability and manufacturability.

Nominal Supply Voltage: 1.2 V

Optimal nominal supply voltage for stable and efficient operation of the microcontroller.

PWM Channels: YES

Integrated PWM channels facilitate precise control of analog outputs, ideal for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization of functionalities as per application requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, optimizing board real estate and interconnectivity.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring proper handling during storage and assembly processes.

Speed: 80 rpm

Capable of operating at a speed of 80 revolutions per minute, suitable for controlling rotational devices and machinery.

No. of I/O Lines: 72

Abundant I/O lines available for versatile interfacing with external peripherals and components, enhancing system connectivity and functionality.

Technical Specifications

Microcontrollers LM3S5B91-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S5B91-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20