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LM3S5762-IQR50-A0

Texas Instruments

LM3S5762-IQR50-A0 by Texas Instruments

Texas Instruments' LM3S5762-IQR50-A0 is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it features 33 I/O lines, PWM channels, and ADC channels for industrial applications requiring high-speed processing in a compact FLATPACK package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,888 parts In-Stock

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4,888

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Digiode

USA . 3,982 parts In-Stock

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3,982

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Distributors (Availability)

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AZTECH Wire

Italy . 631 parts In-Stock

1+ parts

$8.266

100+ parts

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631

$8.266

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One Stop Electronics

USA . 1,223 parts In-Stock

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$23.000

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-

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1,223

$23.000

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Modulus Dynamics

Lithuania . 800 parts In-Stock

1+ parts

$32.962

100+ parts

$32.962

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$32.962

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800

$32.962

$32.962

$32.962

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Microchip USA

USA . 1,463 parts In-Stock

1+ parts

$34.460

100+ parts

$33.960

1k+ parts

$33.720

10k+ parts

$33.470

1,463

$34.460

$33.960

$33.720

$33.470

Parana Technologies

USA . 236 parts In-Stock

1+ parts

$42.837

100+ parts

$3,978.110

1k+ parts

$38.554

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236

$42.837

$3,978.110

$38.554

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DigiPath Technology Company

USA . 344 parts In-Stock

1+ parts

$47.169

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344

$47.169

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ChromeModa Solutions

Germany . 5,748 parts In-Stock

1+ parts

$48.132

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$39.468

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5,748

$48.132

$39.468

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IDEA Electronic Components Group

UK . 1,642 parts In-Stock

1+ parts

$48.132

100+ parts

$45.725

1k+ parts

$43.319

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1,642

$48.132

$45.725

$43.319

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Corphita

USA . 2,616 parts In-Stock

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2,616

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Overview

Elevate your projects with the LM3S5762-IQR50-A0 microcontroller from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability. This powerful 32-bit microcontroller is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this microcontroller provides the performance and versatility you need to bring your ideas to life. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Supply Voltage: 2.75 V

Optimal maximum supply voltage for efficient performance.

Package Shape: SQUARE

Square shape allows for uniform distribution of components.

Bit Size: 32

32-bit architecture enables high processing speed and efficiency.

Power Supplies (V): 2.5, 3.3

Multiple power supply options for flexibility in different applications.

No. of Terminals: 64

Sufficient number of terminals for connectivity and expansion.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient performance for microcontroller tasks.

RAM Bytes: 65536

Large RAM capacity for storing and processing data effectively.

Technical Specifications

Microcontrollers LM3S5762-IQR50-A0 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S5762-IQR50-A0 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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